| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2026 | J | jnl |
IEICE Electron. Express
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2023 | C | conf |
VLSI-SoC
|
| 2023 | J | jnl |
IEICE Electron. Express
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2022 | — | conf |
ICECC
|
| 2021 | — | conf |
EEET
|
| 2019 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2018 | J | jnl |
IEICE Trans. Electron.
|
| 2015 | — | conf |
ASICON
|
| 2014 | J | jnl |
J. Signal Process. Syst.
|
| 2012 | J | jnl |
Mach. Vis. Appl.
|
| 2011 | — | conf |
MLSP
|
| 2009 | — | conf |
ICNC (4)
|
| 2008 | B | conf |
IJCNN
|
| 2007 | — | conf |
ICNC (2)
|
| 2007 | — | conf |
ROBIO
|
| 2006 | — | conf |
ISNN (2)
|
| 2006 | — | conf |
ICB
|
| 2005 | — | conf |
ICNC (3)
|
| 2005 | — | conf |
ISNN (2)
|