| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Digit. Signal Process.
|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2026 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Appl. Soft Comput.
|
| 2025 | J | jnl |
Adv. Eng. Softw.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2023 | J | jnl |
IEEE Trans. Computers
|
| 2022 | J | jnl |
Adv. Eng. Softw.
|
| 2022 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2022 | — | conf |
PRICAI (2)
|
| 2022 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2022 | J | jnl |
Sci. China Inf. Sci.
|
| 2022 | — | conf |
IFTC
|
| 2021 | J | jnl |
IEEE Trans. Parallel Distributed Syst.
|
| 2021 | J | jnl |
Complex.
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Int. J. Embed. Syst.
|
| 2020 | J | jnl |
Adv. Eng. Softw.
|
| 2020 | A* | conf |
ASPLOS
|
| 2020 | Misc | conf |
ICASSP
|
| 2020 | J | jnl |
Inf. Fusion
|
| 2020 | B | conf |
ICPR
|
| 2019 | — | conf |
EIT
|
| 2019 | J | jnl |
J. Electronic Imaging
|
| 2019 | J | jnl |
IEICE Electron. Express
|
| 2019 | J | jnl |
IEICE Electron. Express
|
| 2019 | J | jnl |
Sensors
|
| 2019 | — | conf |
ICITE
|
| 2018 | J | jnl |
Sensors
|
| 2018 | J | jnl |
IEICE Electron. Express
|
| 2018 | — | conf |
ICCDA
|
| 2018 | J | jnl |
Sensors
|
| 2018 | A* | conf |
OSDI
|
| 2018 | J | jnl |
Mach. Learn.
|
| 2018 | — | conf |
SoCC
|
| 2018 | — | conf |
EIT
|
| 2017 | J | jnl |
Sensors
|
| 2017 | B | conf |
IJCNN
|
| 2017 | J | jnl |
CoRR
|
| 2016 | — | — |
|
| 2016 | J | jnl |
Expert Syst. Appl.
|