| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2025 | — | conf |
VTC2025-Fall
|
| 2025 | — | conf |
VTC2025-Spring
|
| 2025 | — | conf |
VTC2025-Spring
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | J | jnl |
IEEE J. Solid State Circuits
|
| 2024 | J | jnl |
Sci. China Inf. Sci.
|
| 2024 | J | jnl |
IEEE Trans. Commun.
|
| 2024 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2024 | B | conf |
ITW
|
| 2023 | — | conf |
ISSCC
|
| 2023 | — | conf |
ISSCC
|
| 2023 | J | jnl |
IEEE J. Solid State Circuits
|
| 2023 | B | conf |
GLOBECOM
|
| 2023 | B | conf |
WCNC
|
| 2023 | J | jnl |
IEEE Trans. Commun.
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2023 | — | conf |
ICC
|
| 2023 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | J | jnl |
IEEE Trans. Commun.
|
| 2023 | — | conf |
ICC
|
| 2022 | B | conf |
GLOBECOM
|
| 2022 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2022 | — | conf |
ICCT
|
| 2022 | — | conf |
ICC
|
| 2022 | J | jnl |
Sci. China Inf. Sci.
|
| 2021 | — | conf |
ICC
|
| 2021 | — | conf |
ICC
|
| 2021 | J | jnl |
Sci. China Inf. Sci.
|
| 2021 | J | jnl |
IEEE J. Sel. Areas Commun.
|
| 2021 | — | conf |
ICCT
|
| 2021 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Commun.
|
| 2021 | J | jnl |
IEEE Trans. Commun.
|
| 2021 | C | conf |
EMO
|
| 2020 | C | conf |
ICCC
|
| 2020 | J | jnl |
IEEE Trans. Commun.
|
| 2020 | C | conf |
ICCC
|
| 2020 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2020 | — | conf |
WCSP
|
| 2020 | J | jnl |
IEEE Trans. Wirel. Commun.
|
| 2020 | — | conf |
6GN
|
| 2020 | J | jnl |
IEEE Wirel. Commun.
|
| 2020 | C | conf |
ICCC
|
| 2018 | — | conf |
CSPS (1)
|