| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | C | conf |
ISCAS
|
| 2025 | J | jnl |
Int. J. Circuit Theory Appl.
|
| 2025 | C | conf |
ISCAS
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2023 | J | jnl |
IEICE Trans. Commun.
|
| 2023 | C | conf |
IECON
|
| 2023 | — | conf |
ISOCC
|
| 2023 | C | conf |
ISCAS
|
| 2023 | C | conf |
ISCAS
|
| 2022 | — | conf |
ISOCC
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | — | conf |
ISIE
|
| 2021 | — | conf |
ISIE
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
ISOCC
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | C | conf |
IECON
|
| 2019 | — | conf |
MWSCAS
|
| 2019 | — | conf |
ISOCC
|
| 2018 | C | conf |
ISCAS
|
| 2018 | — | conf |
ISOCC
|
| 2018 | C | conf |
IECON
|
| 2017 | J | jnl |
Effects of sulfur addition on the wettability and corrosion resistance of Sn-0.7Cu lead-free solder.
Microelectron. Reliab.
|
| 2017 | C | conf |
ISCAS
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2016 | C | conf |
ISCAS
|
| 2016 | — | conf |
APCCAS
|
| 2015 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2015 | C | conf |
ISCAS
|
| 2014 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2014 | J | jnl |
IEICE Trans. Commun.
|
| 2014 | — | conf |
APCCAS
|
| 2014 | C | conf |
ISCAS
|
| 2014 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2014 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2013 | J | jnl |
IEICE Trans. Commun.
|
| 2013 | C | conf |
IECON
|
| 2013 | C | conf |
ISCAS
|
| 2013 | — | conf |
MWSCAS
|
| 2013 | — | conf |
ECCTD
|
| 2012 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2012 | — | conf |
APCCAS
|
| 2012 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2011 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2011 | C | conf |
ISCAS
|
| 2010 | C | conf |
ISCAS
|