| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Smart Grid
|
| 2026 | J | jnl |
IEEE Trans. Netw. Sci. Eng.
|
| 2026 | J | jnl |
J. Documentation
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | J | jnl |
IEEE Trans. Syst. Man Cybern. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | J | jnl |
EAI Endorsed Trans. Scalable Inf. Syst.
|
| 2024 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2024 | J | jnl |
Expert Syst. Appl.
|
| 2024 | — | conf |
ISBI
|
| 2024 | J | jnl |
IEEE Trans. Smart Grid
|
| 2023 | J | jnl |
IEEE Trans. Smart Grid
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | — | conf |
BIBM
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
IRPS
|
| 2022 | J | jnl |
Circuits Syst. Signal Process.
|
| 2021 | J | jnl |
Remote. Sens.
|
| 2021 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2020 | — | conf |
ICAIS (2)
|
| 2018 | — | conf |
An All-Metal Hollow Microstructure for Pool-Boiling Chip-Integrated Cooling Based on Electroplating.
NEMS
|
| 2014 | B | conf |
AINA
|
| 2014 | — | conf |
BWCCA
|
| 2014 | Misc | conf |
CISIS
|
| 2013 | — | conf |
NBiS
|
| 2013 | Misc | conf |
CISIS
|
| 2013 | — | conf |
EIDWT
|
| 2013 | Misc | conf |
CISIS
|
| 2013 | A | conf |
ITCS
|
| 2012 | B | conf |
PIMRC
|