| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Data
|
| 2026 | J | jnl |
Bioinform.
|
| 2026 | J | jnl |
Data Inf. Manag.
|
| 2025 | J | jnl |
Briefings Bioinform.
|
| 2025 | J | jnl |
Complex Intell. Syst.
|
| 2025 | — | conf |
ICAIE
|
| 2025 | J | jnl |
BMC Medical Informatics Decis. Mak.
|
| 2025 | A* | conf |
ICML
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
Comput. Mater. Continua
|
| 2025 | J | jnl |
Quant. Biol.
|
| 2025 | J | jnl |
Comput. Electron. Agric.
|
| 2025 | J | jnl |
Comput. Electron. Agric.
|
| 2024 | — | conf |
NPC (2)
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
Decline in Planting Areas of Double-Season Rice by Half in Southern China over the Last Two Decades.
Remote. Sens.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ICAICE
|
| 2024 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | J | jnl |
Comput. Biol. Medicine
|
| 2022 | — | conf |
MSN
|
| 2022 | J | jnl |
IEEE Trans. Artif. Intell.
|
| 2021 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2021 | J | jnl |
Symmetry
|
| 2021 | A* | conf |
AAAI
|
| 2021 | J | jnl |
Remote. Sens.
|
| 2020 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2019 | J | jnl |
Appl. Intell.
|
| 2019 | J | jnl |
Remote. Sens.
|
| 2018 | J | jnl |
Study on Dipping Mathematical Models for the Solder Flip-Chip Bonding in Microelectronics Packaging.
IEEE Trans. Ind. Informatics
|
| 2018 | J | jnl |
IEEE Access
|
| 2016 | J | jnl |
Pervasive Mob. Comput.
|
| 2016 | — | conf |
CITS
|
| 2015 | — | conf |
UIC/ATC/ScalCom
|
| 2010 | Misc | conf |
ICMLC
|
| 2006 | C | conf |
APSCC
|