| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2026 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2026 | J | jnl |
Inf. Fusion
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEICE Electron. Express
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2025 | J | jnl |
Symmetry
|
| 2025 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ISBI
|
| 2025 | — | conf |
BIBM
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2025 | J | jnl |
Comput. Mater. Continua
|
| 2025 | J | jnl |
ACM Trans. Inf. Syst.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | — | conf |
CAIBDA
|
| 2024 | J | jnl |
Ann. GIS
|
| 2024 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2024 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | J | jnl |
J. Vis. Commun. Image Represent.
|
| 2024 | J | jnl |
Intell. Data Anal.
|
| 2024 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2024 | J | jnl |
Intell. Data Anal.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | — | conf |
LREC/COLING
|
| 2024 | C | conf |
INDIN
|
| 2024 | J | jnl |
IEEE Trans. Multim.
|
| 2024 | — | conf |
BESC
|
| 2023 | — | conf |
ISIE
|
| 2023 | J | jnl |
Trans. GIS
|
| 2023 | — | conf |
ADMA (1)
|
| 2023 | — | conf |
AMC-SME
|
| 2022 | J | jnl |
IEICE Electron. Express
|
| 2022 | — | conf |
EMNLP (Findings)
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
IEEE/ACM Trans. Netw.
|
| 2022 | — | conf |
HCI (45)
|
| 2021 | J | jnl |
IEICE Electron. Express
|
| 2021 | J | jnl |
Remote. Sens.
|
| 2021 | J | jnl |
Adv. Intell. Syst.
|
| 2020 | A* | conf |
INFOCOM
|
| 2020 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2019 | J | jnl |
Complex.
|
| 2019 | C | conf |
IGARSS
|
| 2019 | B | conf |
IJCNN
|
| 2019 | J | jnl |
Ann. des Télécommunications
|
| 2019 | A | conf |
DSN
|
| 2018 | — | conf |
SIGCOMM Posters and Demos
|
| 2018 | J | jnl |
CoRR
|
| 2018 | B | conf |
Big Data (CCF)
|
| 2018 | — | conf |
SecDev
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2017 | J | jnl |
IET Commun.
|
| 2017 | J | jnl |
ACM Trans. Archit. Code Optim.
|
| 2017 | C | conf |
ACC
|
| 2017 | J | jnl |
计算机科学
|
| 2016 | C | conf |
ISCAS
|
| 2015 | J | jnl |
Microelectron. J.
|
| 2014 | J | jnl |
CoRR
|
| 2014 | — | conf |
SPAC
|
| 2014 | J | jnl |
J. Commun.
|
| 2010 | — | conf |
ICAART (1)
|
| 2008 | B | conf |
GLOBECOM
|
| 2008 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2008 | — | conf |
VTC Spring
|
| 2008 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2005 | B | conf |
WCNC
|
| 2004 | B | conf |
PIMRC
|
| 2004 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2003 | B | conf |
PIMRC
|
| 2003 | B | conf |
WCNC
|