Xiaoxian Liu

30 papers B 1C 2Misc 1Journal 23Unranked 3
YearRankTypeTitle / Venue / Authors
2025 J jnl
Compact On-Chip Half-Mode SIW-Based Dual-Band Bandpass Filter Using 3-D Stacked Inductors With Controllable Transmission Zero.
IEEE Trans. Very Large Scale Integr. Syst.
Nuo Liu, Xiaoxian Liu, Lei Zhang, Chenhui Fan, Zhangming Zhu
2025 B conf
Efficient and Privacy-Preserving (α, β)-Core Community Search over Encrypted Bipartite Graphs.
TrustCom
Xiaoxian Liu, Chen Chen, Xueqiao Liu, Xiaoyang Wang
2025 Misc conf
Online Adaptive Rumor Blocking with Pertinence Set.
ADC
Renzhe Miao, Fangsong Xiang, Xiaoxian Liu, Xijuan Liu, Ying Zhang
2025 — conf
α-Forest: Proxy-Cloud Enabled Efficient and Secure Community Search over Encrypted Bipartite Graphs.
WIFS
Xiaoxian Liu, Chen Chen, Xueqiao Liu, Xiaoyang Wang
2024 J jnl
An Evaluation of Ecosystem Quality and Its Response to Aridity on the Qinghai-Tibet Plateau.
Remote. Sens.
Yimeng Yan, Jiaxi Cao, Yufan Gu, Xuening Huang, Xiaoxian Liu, Yue Hu, Shuhong Wu
2023 J jnl
A Composite Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Fields.
IEEE Trans. Circuits Syst. II Express Briefs
Lei Wang, Xiaoxian Liu, Yunfei En, Zhangming Zhu
2023 J jnl
A Ka-band fourth-order SIW filter power divider with wide out-of-band suppression.
Microelectron. J.
Chenhui Fan, Xiaoxian Liu, Nuo Liu, Yintang Yang
2023 J jnl
A Resonant Magnetic Probe Capable of Simultaneously Measuring Two Orthogonal Magnetic-Field Components.
IEEE Trans. Circuits Syst. II Express Briefs
Lei Wang, Xiaoxian Liu, Chengyang Luo, Zhangming Zhu
2023 J jnl
Filtering SIW phase shifter based on through quartz vias technology.
Microelectron. J.
Nuo Liu, Xiaoxian Liu, Chenhui Fan
2023 J jnl
Substrate-Integrated Waveguide Band-Pass Filter and Diplexer With Controllable Transmission Zeros and Wide-Stopband.
IEEE Trans. Circuits Syst. II Express Briefs
Xiaoxian Liu, Yang Liu, Tao Zhang, Qijun Lu, Zhangming Zhu
2022 J jnl
An effective method to suppress high-order modes of SIW filters with compact size.
Microelectron. J.
Chenhui Fan, Xiaoxian Liu, Nuo Liu, Yintang Yang, Zhangming Zhu
2021 J jnl
Area-Efficient Extended 3-D Inductor Based on TSV Technology for RF Applications.
IEEE Trans. Very Large Scale Integr. Syst.
Chenbing Qu, Zhangming Zhu, Yunfei En, Liwei Wang, Xiaoxian Liu
2021 J jnl
Design of compact LC lowpass filters based on coaxial through-silicon vias array.
Microelectron. J.
Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu
2020 J jnl
Physics based scalable inductance model for three-dimensional solenoid inductors.
Microelectron. J.
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
2020 J jnl
Voltage Comparator With 60% Faster Speed by Using Charge Pump.
IEEE Trans. Circuits Syst.
Haoyu Zhuang, He Tang, Xiaoxian Liu
2020 J jnl
Voltage Reference With Linear-Temperature-Dependent Power Consumption.
IEEE Trans. Very Large Scale Integr. Syst.
Haoyu Zhuang, Xiaoxian Liu, Hao Wang
2019 J jnl
Broadband inductance modeling of TXVs for 3D interconnection.
Microelectron. J.
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Lixin Guo, Yintang Yang
2019 J jnl
Electromagnetic modeling and analysis of the tapered differential through glass vias.
Microelectron. J.
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang
2018 — conf
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.
APCCAS
Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
2018 J jnl
Temperature-dependent characterizations on parasitic capacitance of tapered through silicon via (T-TSV).
IEICE Electron. Express
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Huaxi Gu, Lixin Guo
2014 C conf
A multiscale region-based approach to automatic SAR image registration using CLPSO.
IGARSS
Guiting Wang, Xiaoxian Liu, Licheng Jiao, Shuang Wang
2014 J jnl
Capacitance characterization of tapered through-silicon-via considering MOS effect.
Microelectron. J.
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding
2014 J jnl
Temperature properties of the parasitic resistance of through-silicon vias (TSVs) in high-frequency 3-D ICs.
IEICE Electron. Express
Yintang Yang, Xiaoxian Liu, Zhangming Zhu, Ruixue Ding
2013 C conf
A Compile-Time Cost Model for Automatic OpenMP Decoupled Software Pipelining Parallelization.
SNPD
Xiaoxian Liu, Rongcai Zhao, Lin Han
2013 — conf
An Automatic Parallel-Stage Decoupled Software Pipelining Parallelization Algorithm Based on OpenMP.
TrustCom/ISPA/IUCC
Xiaoxian Liu, Rongcai Zhao, Lin Han, Peng Liu
2013 J jnl
Analytical models for the thermal strain and stress induced by annular through-silicon-via (TSV).
IEICE Electron. Express
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding
2013 J jnl
Erratum: The impact of trapping centers on AlGaN/GaN resonant tunneling diode [IEICE Electronics Express Vol 10 (2013) No 19 pp 20130588].
IEICE Electron. Express
Haoran Chen, Lin-An Yang, Xiaoxian Liu, Zhangming Zhu, Jun Luo, Yue Hao
2013 J jnl
Reduction of signal reflection in high-frequency three-dimensional (3D) integration circuits.
IEICE Electron. Express
Xiaoxian Liu, Zhangming Zhu, Yintang Yang, Fengjuan Wang, Ruixue Ding
2013 J jnl
The impact of trapping centers on AlGaN/GaN resonant tunneling diode.
IEICE Electron. Express
Haoran Chen, Lin-An Yang, Xiaoxian Liu, Zhangming Zhu, Jun Luo, Yue Hao
2013 J jnl
Thermo-mechanical performance of Cu and SiO
IEICE Electron. Express
Fengjuan Wang, Zhangming Zhu, Yintang Yang, Xiaoxian Liu, Ruixue Ding