| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEICE Electron. Express
|
| 2026 | J | jnl |
Adv. Eng. Informatics
|
| 2025 | — | conf |
ICECET
|
| 2025 | J | jnl |
J. Comput. Phys.
|
| 2025 | J | jnl |
J. Imaging Inform. Medicine
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Microelectron. J.
|
| 2025 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2025 | J | jnl |
Comput. Ind. Eng.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEICE Electron. Express
|
| 2025 | J | jnl |
Adv. Eng. Informatics
|
| 2025 | J | jnl |
Inf.
|
| 2024 | J | jnl |
Comput. Math. Appl.
|
| 2024 | J | jnl |
Appl. Math. Lett.
|
| 2024 | B | conf |
TrustCom
|
| 2024 | J | jnl |
Clust. Comput.
|
| 2024 | J | jnl |
IEEE J. Biomed. Health Informatics
|
| 2024 | J | jnl |
Intell. Decis. Technol.
|
| 2023 | J | jnl |
Sci. China Inf. Sci.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
Comput. Math. Appl.
|
| 2023 | J | jnl |
Qual. Reliab. Eng. Int.
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | J | jnl |
CoRR
|
| 2022 | J | jnl |
Secur. Commun. Networks
|
| 2022 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2022 | J | jnl |
Wirel. Pers. Commun.
|
| 2022 | — | conf |
VLSI Technology and Circuits
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2021 | J | jnl |
Sci. China Inf. Sci.
|
| 2021 | J | jnl |
Sensors
|
| 2021 | J | jnl |
Quantum Inf. Process.
|
| 2021 | J | jnl |
Complex.
|
| 2021 | — | conf |
ASICON
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
Sensors
|
| 2019 | J | jnl |
J. Comput. Phys.
|
| 2018 | J | jnl |
Sci. China Inf. Sci.
|
| 2017 | J | jnl |
计算机科学
|
| 2016 | J | jnl |
计算机科学
|
| 2013 | — | conf |
VTC Spring
|
| 2013 | — | conf |
WPMC
|
| 2012 | — | conf |
ISCTCS
|