| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Multim. Syst.
|
| 2026 | J | jnl |
J. Comput. Des. Eng.
|
| 2024 | J | jnl |
Comput. Electr. Eng.
|
| 2024 | J | jnl |
Inf.
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2023 | J | jnl |
Neural Comput. Appl.
|
| 2021 | J | jnl |
Adv. Eng. Informatics
|
| 2021 | J | jnl |
Sensors
|
| 2021 | J | jnl |
Int. J. Pattern Recognit. Artif. Intell.
|
| 2020 | — | conf |
IEEM
|
| 2019 | J | jnl |
Int. J. Prod. Res.
|
| 2018 | — | conf |
ICCL
|
| 2016 | J | jnl |
Int. J. Inf. Technol. Manag.
|
| 2016 | C | conf |
HSI
|
| 2016 | — | conf |
IDCS
|
| 2014 | J | jnl |
Int. J. Big Data Intell.
|
| 2013 | J | jnl |
Int. J. RF Technol. Res. Appl.
|
| 2011 | J | jnl |
Microelectron. J.
|