| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Solid State Circuits Lett.
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
npj Digit. Medicine
|
| 2025 | — | conf |
ICCAI
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2024 | J | jnl |
J. Comput. Phys.
|
| 2024 | J | jnl |
IEEE Robotics Autom. Lett.
|
| 2024 | J | jnl |
Int. J. Circuit Theory Appl.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2024 | J | jnl |
Comput. Appl. Eng. Educ.
|
| 2023 | J | jnl |
Comput. Math. Appl.
|
| 2023 | — | conf |
EITCE
|
| 2022 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | — | conf |
AsiaSim (2)
|
| 2022 | C | conf |
IPIN
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Sensors
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Multim. Tools Appl.
|
| 2020 | J | jnl |
Sensors
|
| 2019 | — | conf |
BlockSys
|
| 2019 | — | conf |
IoT S&P@CCS
|
| 2019 | J | jnl |
IEEE CAA J. Autom. Sinica
|
| 2018 | — | conf |
BIBM
|
| 2018 | — | conf |
SmartCom
|
| 2017 | J | jnl |
Remote. Sens.
|
| 2017 | J | jnl |
ISPRS Int. J. Geo Inf.
|
| 2017 | C | conf |
Healthcom
|
| 2016 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2016 | B | conf |
ICPR
|
| 2016 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2016 | — | conf |
VRCAI
|
| 2016 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2014 | — | conf |
ISIE
|
| 2014 | J | jnl |
IEEE Trans. Smart Grid
|
| 2013 | J | jnl |
BMC Medical Imaging
|
| 2012 | — | conf |
AsiaSim (3)
|
| 2008 | J | jnl |
J. Comput. Phys.
|
| 2007 | J | jnl |
IEEE J. Sel. Areas Commun.
|