| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEICE Electron. Express
|
| 2025 | — | conf |
SIGSOFT FSE Companion
|
| 2025 | J | jnl |
Proc. ACM Softw. Eng.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ACL (1)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
ICSE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
SIGIR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
ACM Trans. Softw. Eng. Methodol.
|
| 2023 | A* | conf |
ASE
|
| 2023 | C | conf |
APSEC
|
| 2023 | A* | conf |
ICSE
|
| 2022 | J | jnl |
IEEE Trans. Reliab.
|
| 2022 | A* | conf |
ICSE
|
| 2021 | J | jnl |
Wirel. Commun. Mob. Comput.
|
| 2019 | — | conf |
ChineseCSCW
|
| 2015 | — | conf |
IScIDE (1)
|
| 2014 | — | conf |
ICIA
|