Xiangkun Yin

23 papers Journal 22Unranked 1
YearRankTypeTitle / Venue / Authors
2026 J jnl
BP-PSO hybrid intelligent optimization for high-density TSV-based 3D transformer with enhanced voltage gain and area efficiency.
Microelectron. J.
Guoliang Zhu, Feng Liu, Xiangkun Yin, Xuan Wang, Yawei Liu, Yu Yan, Xuan Liu
2026 J jnl
High-density double-helix inductor based on coaxial through-silicon via and its analytical model.
Microelectron. J.
Xiangkun Yin, Nairong Liu, Fengjuan Wang, Xiang Li, Tao Zhang, Qijun Lu, Libo Qian
2025 J jnl
A Wideband Compact Digitally-Assisted Variable Gain Phase Shifter for Ka-Band Applications.
IEEE Trans. Circuits Syst. II Express Briefs
Tao Zhang, Haohui Chen, Weihong Lu, Qijun Lu, Xiangkun Yin, Xin An, Bei Liu, Zhangming Zhu
2025 J jnl
Parasitic-induced multi-zero generation and port-fusion compact filter based on 3-D through-silicon via technology.
Microelectron. J.
Xiangkun Yin, Xiangyu Ma, Nairong Liu, Libo Qian, Tao Zhang, Qijun Lu, Zhangming Zhu
2025 J jnl
Towards miniaturization: Reflectionless filter with sharp roll-off characterization based on through-silicon via.
Microelectron. J.
Fengjuan Wang, Kai Li, Xiangkun Yin, Jiangfan Liu, Yiqun Liu, Yuan Yang
2024 J jnl
A compact fifth-order SIW BPF based on TSV technology with high selectivity.
Microelectron. J.
Fengjuan Wang, Jilin Kou, Xiangkun Yin, Jiangfan Liu, Kai Jing, Ningmei Yu, Yuan Yang, Qian Li
2024 J jnl
Effect of annealing residual stress on mobility of TSV vertical switch.
IEICE Electron. Express
Fengjuan Wang, Jiashuo Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang, Kai Jing, Qian Li
2023 J jnl
Miniaturized silicon-based substrate integrated waveguide filter for 6G applications.
Microelectron. J.
Fengjuan Wang, Ying Lu, Xiangkun Yin, Jiangfan Liu, Ningmei Yu, Yuan Yang
2023 J jnl
TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications.
IEICE Electron. Express
Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang
2022 J jnl
A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application.
IEEE Trans. Very Large Scale Integr. Syst.
Fengjuan Wang, Kai Zhang, Xiangkun Yin, Ningmei Yu, Yuan Yang
2022 J jnl
A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line.
IEICE Electron. Express
Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang
2022 J jnl
Compact high-performance dual-frequency power divider based on TSV.
Microelectron. J.
Fengjuan Wang, Ruiqi Li, Xiangkun Yin, Ningmei Yu, Yuan Yang
2022 J jnl
Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application.
Microelectron. J.
Xiangkun Yin, Jingyu Lu, Fengjuan Wang
2022 J jnl
Wideband transmission optimization for heterogenous interconnection in 3D IC.
IEICE Electron. Express
Xiangkun Yin, Jingyu Lu, Fengjuan Wang
2021 J jnl
A transformer with high coupling coefficient and small area based on TSV.
Integr.
Fengjuan Wang, Ruinan Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang
2021 J jnl
Analytical models of AC inductance and quality factor for TSV-based inductor.
IEICE Electron. Express
Xiangkun Yin, Fengjuan Wang
2021 J jnl
Compact TSV-Based Hairpin Bandpass Filter for Thz Applications.
IEEE Access
Fengjuan Wang, Lei Ke, Xiangkun Yin, Ningmei Yu, Yuan Yang
2021 J jnl
Design of compact LC lowpass filters based on coaxial through-silicon vias array.
Microelectron. J.
Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu
2021 J jnl
TSV-based hairpin bandpass filter for 6G mobile communication applications.
IEICE Electron. Express
Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang
2020 J jnl
Physics based scalable inductance model for three-dimensional solenoid inductors.
Microelectron. J.
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
2019 J jnl
Electromagnetic modeling and analysis of the tapered differential through glass vias.
Microelectron. J.
Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang
2018 — conf
Inductance of Different Profiles of Through Glass Vias based on magnetic flux density.
APCCAS
Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
2015 J jnl
Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon.
IEICE Electron. Express
Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang