Xiangkun Yin - RankMe

23 papers Journal 22Unranked 1

Year	Rank	Type	Title / Venue / Authors
2026	J	`jnl`	BP-PSO hybrid intelligent optimization for high-density TSV-based 3D transformer with enhanced voltage gain and area efficiency. Microelectron. J. Guoliang Zhu, Feng Liu, Xiangkun Yin, Xuan Wang, Yawei Liu, Yu Yan, Xuan Liu
2026	J	`jnl`	High-density double-helix inductor based on coaxial through-silicon via and its analytical model. Microelectron. J. Xiangkun Yin, Nairong Liu, Fengjuan Wang, Xiang Li, Tao Zhang, Qijun Lu, Libo Qian
2025	J	`jnl`	A Wideband Compact Digitally-Assisted Variable Gain Phase Shifter for Ka-Band Applications. IEEE Trans. Circuits Syst. II Express Briefs Tao Zhang, Haohui Chen, Weihong Lu, Qijun Lu, Xiangkun Yin, Xin An, Bei Liu, Zhangming Zhu
2025	J	`jnl`	Parasitic-induced multi-zero generation and port-fusion compact filter based on 3-D through-silicon via technology. Microelectron. J. Xiangkun Yin, Xiangyu Ma, Nairong Liu, Libo Qian, Tao Zhang, Qijun Lu, Zhangming Zhu
2025	J	`jnl`	Towards miniaturization: Reflectionless filter with sharp roll-off characterization based on through-silicon via. Microelectron. J. Fengjuan Wang, Kai Li, Xiangkun Yin, Jiangfan Liu, Yiqun Liu, Yuan Yang
2024	J	`jnl`	A compact fifth-order SIW BPF based on TSV technology with high selectivity. Microelectron. J. Fengjuan Wang, Jilin Kou, Xiangkun Yin, Jiangfan Liu, Kai Jing, Ningmei Yu, Yuan Yang, Qian Li
2024	J	`jnl`	Effect of annealing residual stress on mobility of TSV vertical switch. IEICE Electron. Express Fengjuan Wang, Jiashuo Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang, Kai Jing, Qian Li
2023	J	`jnl`	Miniaturized silicon-based substrate integrated waveguide filter for 6G applications. Microelectron. J. Fengjuan Wang, Ying Lu, Xiangkun Yin, Jiangfan Liu, Ningmei Yu, Yuan Yang
2023	J	`jnl`	TSV-based SIW bandpass filter with adjustable transmission zeros for D-band applications. IEICE Electron. Express Fengjuan Wang, Zhuoyu Yang, Xiangkun Yin, Ningmei Yu, Yuan Yang
2022	J	`jnl`	A Miniaturized Wideband Interdigital Bandpass Filter With High Out-Band Suppression Based on TSV Technology for W-Band Application. IEEE Trans. Very Large Scale Integr. Syst. Fengjuan Wang, Kai Zhang, Xiangkun Yin, Ningmei Yu, Yuan Yang
2022	J	`jnl`	A miniature TSV-based branch line coupler using π equivalent circuit model for transmission line. IEICE Electron. Express Fengjuan Wang, Sa Xiao, Xiangkun Yin, Ningmei Yu, Yuan Yang
2022	J	`jnl`	Compact high-performance dual-frequency power divider based on TSV. Microelectron. J. Fengjuan Wang, Ruiqi Li, Xiangkun Yin, Ningmei Yu, Yuan Yang
2022	J	`jnl`	Optimization of heterogeneous interconnection transmission based on impedance matching for 3-D IC high-frequency application. Microelectron. J. Xiangkun Yin, Jingyu Lu, Fengjuan Wang
2022	J	`jnl`	Wideband transmission optimization for heterogenous interconnection in 3D IC. IEICE Electron. Express Xiangkun Yin, Jingyu Lu, Fengjuan Wang
2021	J	`jnl`	A transformer with high coupling coefficient and small area based on TSV. Integr. Fengjuan Wang, Ruinan Ren, Xiangkun Yin, Ningmei Yu, Yuan Yang
2021	J	`jnl`	Analytical models of AC inductance and quality factor for TSV-based inductor. IEICE Electron. Express Xiangkun Yin, Fengjuan Wang
2021	J	`jnl`	Compact TSV-Based Hairpin Bandpass Filter for Thz Applications. IEEE Access Fengjuan Wang, Lei Ke, Xiangkun Yin, Ningmei Yu, Yuan Yang
2021	J	`jnl`	Design of compact LC lowpass filters based on coaxial through-silicon vias array. Microelectron. J. Xiangkun Yin, Fengjuan Wang, Vasilis F. Pavlidis, Xiaoxian Liu, Qijun Lu, Tao Zhang, Yang Liu
2021	J	`jnl`	TSV-based hairpin bandpass filter for 6G mobile communication applications. IEICE Electron. Express Fengjuan Wang, Lei Ke, Xiangkun Yin, Vasilis F. Pavlidis, Ningmei Yu, Yuan Yang
2020	J	`jnl`	Physics based scalable inductance model for three-dimensional solenoid inductors. Microelectron. J. Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
2019	J	`jnl`	Electromagnetic modeling and analysis of the tapered differential through glass vias. Microelectron. J. Yang Liu, Zhangming Zhu, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Lixin Guo, Yintang Yang
2018	—	`conf`	Inductance of Different Profiles of Through Glass Vias based on magnetic flux density. APCCAS Yang Liu, Zhangming Zhu, Ruixue Ding, Xiaoxian Liu, Qijun Lu, Xiangkun Yin, Yintang Yang
2015	J	`jnl`	Effects of coaxial through-silicon via on carrier mobility along [100] and [110] crystal directions of (100) silicon. IEICE Electron. Express Fengjuan Wang, Ningmei Yu, Zhangming Zhu, Xiangkun Yin, Yintang Yang