| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2025 | J | jnl |
Signal Process. Image Commun.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | — | conf |
BMSB
|
| 2023 | — | conf |
AIPR
|
| 2023 | — | conf |
AIPR
|
| 2023 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | — | conf |
ICNSC
|
| 2020 | J | jnl |
J. Intell. Manuf.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
CASE
|
| 2019 | J | jnl |
J. Intell. Manuf.
|
| 2018 | — | conf |
CASE
|
| 2018 | J | jnl |
Comput. Ind.
|
| 2016 | — | conf |
MoWNet
|
| 2015 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2014 | J | jnl |
Knowl. Based Syst.
|
| 2014 | J | jnl |
IEEE ACM Trans. Comput. Biol. Bioinform.
|
| 2014 | J | jnl |
Multisensor Fusion System for Monitoring High-Power Disk Laser Welding Using Support Vector Machine.
IEEE Trans. Ind. Informatics
|
| 2013 | J | jnl |
IEEE Trans. Control. Syst. Technol.
|
| 2012 | J | jnl |
IEEE Trans. Ind. Electron.
|