| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
Int. J. Comput. Integr. Manuf.
|
| 2021 | J | jnl |
CoRR
|
| 2020 | J | jnl |
Comput. Ind. Eng.
|
| 2020 | J | jnl |
Neurocomputing
|
| 2019 | — | conf |
ICAC
|
| 2018 | J | jnl |
CoRR
|
| 2018 | — | conf |
BICS
|
| 2017 | — | conf |
LSMS/ICSEE (1)
|
| 2016 | J | jnl |
Multidimens. Syst. Signal Process.
|
| 2016 | J | jnl |
Electron. Commer. Res. Appl.
|
| 2015 | — | conf |
BigMM
|
| 2012 | — | conf |
APMS (1)
|