| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Internet Things J.
|
| 2026 | J | jnl |
IEEE Trans. Comput. Soc. Syst.
|
| 2026 | J | jnl |
IEEE Commun. Lett.
|
| 2026 | J | jnl |
Appl. Soft Comput.
|
| 2025 | — | conf |
ROBIO
|
| 2025 | B | conf |
ISIT
|
| 2025 | J | jnl |
IEEE Commun. Lett.
|
| 2025 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
Inf. Sci.
|
| 2024 | A* | conf |
OSDI
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Proc. ACM Program. Lang.
|
| 2023 | A* | conf |
SIGIR
|
| 2023 | — | conf |
BMSB
|
| 2023 | — | conf |
BMSB
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2023 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2022 | — | conf |
ICCSIE
|
| 2022 | — | conf |
AIAM
|
| 2021 | — | conf |
ICAIS (2)
|
| 2021 | J | jnl |
J. Syst. Control. Eng.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
Secur. Commun. Networks
|
| 2021 | — | conf |
ACM TUR-C
|
| 2020 | B | conf |
IWCMC
|
| 2020 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2020 | — | conf |
ChineseCSCW
|
| 2019 | J | jnl |
IEICE Trans. Electron.
|
| 2019 | J | jnl |
IEEE Access
|
| 2017 | — | conf |
MSN
|
| 2016 | J | jnl |
Inf. Technol. Manag.
|