| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Comput. Ind. Eng.
|
| 2026 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2026 | A* | conf |
AAAI
|
| 2026 | J | jnl |
BMC Medical Informatics Decis. Mak.
|
| 2026 | J | jnl |
IEEE Trans. Comput. Soc. Syst.
|
| 2026 | J | jnl |
Comput. Ind. Eng.
|
| 2026 | J | jnl |
Adv. Eng. Informatics
|
| 2026 | J | jnl |
Expert Syst. Appl.
|
| 2026 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2025 | J | jnl |
Adv. Eng. Informatics
|
| 2025 | J | jnl |
Comput. Ind. Eng.
|
| 2025 | Misc | conf |
ICASSP
|
| 2025 | J | jnl |
Educ. Inf. Technol.
|
| 2025 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2025 | — | conf |
CASE
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Comput. Biol. Chem.
|
| 2025 | J | jnl |
Comput. Electron. Agric.
|
| 2025 | J | jnl |
J. Intell. Manuf.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE J. Biomed. Health Informatics
|
| 2025 | J | jnl |
ACM Trans. Embed. Comput. Syst.
|
| 2025 | J | jnl |
Trans. GIS
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Methods for Improving Point Cloud Authenticity in LiDAR Simulation for Autonomous Driving: A Review.
IEEE Access
|
| 2025 | J | jnl |
IEEE Trans. Aerosp. Electron. Syst.
|
| 2025 | — | conf |
BIBM
|
| 2025 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2025 | J | jnl |
BMC Medical Informatics Decis. Mak.
|
| 2025 | J | jnl |
Entropy
|
| 2025 | J | jnl |
Discret. Appl. Math.
|
| 2025 | A | conf |
RTSS
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
DASFAA (2)
|
| 2025 | J | jnl |
Adv. Eng. Informatics
|
| 2024 | J | jnl |
Adv. Eng. Informatics
|
| 2024 | — | conf |
EITCE
|
| 2024 | J | jnl |
IEEE Trans. Comput. Soc. Syst.
|
| 2024 | J | jnl |
Adv. Eng. Informatics
|
| 2024 | J | jnl |
IEEE Trans. Geosci. Remote. Sens.
|
| 2024 | J | jnl |
Comput. Ind. Eng.
|
| 2024 | J | jnl |
Int. J. Comput. Integr. Manuf.
|
| 2024 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
IoTAAI
|
| 2024 | J | jnl |
J. Intell. Manuf.
|
| 2024 | J | jnl |
Mach. Learn.
|
| 2024 | J | jnl |
Comput. Electron. Agric.
|
| 2024 | — | conf |
ICSI (1)
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
IEEE Access
|
| 2024 | Misc | conf |
ICASSP
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
Industrial computed tomography based intelligent non-destructive testing method for power capacitor.
ISCMI
|
| 2024 | J | jnl |
Int. J. Comput. Sci. Eng.
|
| 2024 | J | jnl |
Int. J. Parallel Program.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
Future Gener. Comput. Syst.
|
| 2024 | J | jnl |
ACM Trans. Knowl. Discov. Data
|
| 2024 | J | jnl |
Comput. Ind. Eng.
|
| 2024 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2024 | J | jnl |
KSII Trans. Internet Inf. Syst.
|
| 2024 | J | jnl |
Remote. Sens.
|
| 2024 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2024 | J | jnl |
Int. J. Wirel. Mob. Comput.
|
| 2024 | — | conf |
IEEM
|
| 2024 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2024 | J | jnl |
Adv. Eng. Informatics
|
| 2024 | J | jnl |
IEEE Trans. Cloud Comput.
|
| 2024 | J | jnl |
IEEE Trans. Neural Networks Learn. Syst.
|
| 2024 | J | jnl |
CoRR
|
| 2023 | — | conf |
CASE
|
| 2023 | — | conf |
CASE
|
| 2023 | — | conf |
IEEM
|
| 2023 | — | conf |
CASE
|
| 2023 | — | conf |
IEEM
|
| 2023 | J | jnl |
Int. J. Prod. Res.
|
| 2023 | — | conf |
DMBD (1)
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2023 | — | conf |
ICBDC
|
| 2023 | J | jnl |
IEEE Trans. Multim.
|
| 2023 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
ICDIP
|
| 2023 | J | jnl |
Remote. Sens.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
J. Intell. Manuf.
|
| 2023 | A* | conf |
ACM Multimedia
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Industrial computed tomography based intelligent non-destructive testing method for power capacitor.
CoRR
|
| 2023 | J | jnl |
Adv. Eng. Informatics
|
| 2023 | J | jnl |
Biomed. Signal Process. Control.
|
| 2023 | C | conf |
iSPEC
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
ICSI (1)
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ICHMI
|
| 2023 | C | conf |
iSPEC
|
| 2023 | A | conf |
CIKM
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
CIPAE
|
| 2023 | — | conf |
CIPAE
|
| 2022 | — | conf |
DMBD (1)
|
| 2022 | — | conf |
IEEM
|
| 2022 | — | conf |
CASE
|
| 2022 | J | jnl |
Inf. Sci.
|
| 2022 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2022 | — | conf |
ACAI
|
| 2022 | J | jnl |
Int. J. Appl. Earth Obs. Geoinformation
|
| 2022 | J | jnl |
Biomed. Signal Process. Control.
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | — | conf |
CASE
|
| 2022 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2022 | — | conf |
NAACL-HLT (Findings)
|
| 2022 | — | conf |
PRCV (3)
|
| 2022 | J | jnl |
IEEE Trans. Neural Networks Learn. Syst.
|
| 2022 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2022 | J | jnl |
J. Intell. Manuf.
|
| 2022 | J | jnl |
Comput. Oper. Res.
|
| 2022 | — | conf |
CWSN
|
| 2022 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2022 | J | jnl |
ACM Trans. Asian Low Resour. Lang. Inf. Process.
|
| 2022 | — | conf |
IEEM
|
| 2022 | J | jnl |
Int. J. Comput. Integr. Manuf.
|
| 2022 | J | jnl |
Robotics Comput. Integr. Manuf.
|
| 2022 | J | jnl |
J. Cloud Comput.
|
| 2022 | J | jnl |
BMC Medical Informatics Decis. Mak.
|
| 2022 | — | conf |
DMBD (1)
|
| 2022 | — | conf |
IEEM
|
| 2022 | — | conf |
ACCV (4)
|
| 2022 | J | jnl |
Nucleic Acids Res.
|
| 2021 | — | conf |
ComComAP
|
| 2021 | J | jnl |
IEICE Electron. Express
|
| 2021 | J | jnl |
Comput. Ind. Eng.
|
| 2021 | J | jnl |
Pattern Recognit.
|
| 2021 | J | jnl |
J. Intell. Manuf.
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2021 | J | jnl |
BMC Medical Imaging
|
| 2021 | J | jnl |
CoRR
|
| 2021 | B | conf |
PPoPP
|
| 2021 | J | jnl |
J. Intell. Manuf.
|
| 2021 | J | jnl |
Comput. Oper. Res.
|
| 2021 | J | jnl |
NeuroImage
|
| 2021 | — | conf |
ICBK
|
| 2021 | B | conf |
SECON
|
| 2021 | J | jnl |
Sensors
|
| 2021 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2021 | — | conf |
CASE
|
| 2021 | — | conf |
CASE
|
| 2021 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2021 | — | conf |
ICA3PP (2)
|
| 2021 | J | jnl |
Comput. Ind. Eng.
|
| 2021 | — | conf |
CECNet
|
| 2021 | J | jnl |
Sci. Program.
|
| 2021 | B | conf |
COMPSAC
|
| 2021 | — | conf |
CECNet
|
| 2021 | — | conf |
CASE
|
| 2021 | J | jnl |
IEEE Trans. Netw. Sci. Eng.
|
| 2020 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2020 | — | conf |
ICBDT
|
| 2020 | J | jnl |
J. Intell. Manuf.
|
| 2020 | J | jnl |
IEEE Geosci. Remote. Sens. Lett.
|
| 2020 | — | conf |
ICCAI
|
| 2020 | J | jnl |
IEEE Trans. Circuits Syst.
|
| 2020 | — | conf |
ICKG
|
| 2020 | B | conf |
ICTAI
|
| 2020 | — | conf |
CASE
|
| 2020 | J | jnl |
Remote. Sens.
|
| 2020 | J | jnl |
Digit. Commun. Networks
|
| 2020 | J | jnl |
Ind. Manag. Data Syst.
|
| 2020 | J | jnl |
J. Supercomput.
|
| 2020 | A* | conf |
IJCAI
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
CASE
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
Enterp. Inf. Syst.
|
| 2019 | J | jnl |
Comput. Ind. Eng.
|
| 2019 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2019 | — | conf |
CASE
|
| 2019 | — | conf |
ICSI (1)
|
| 2019 | C | conf |
ICMV
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
ICIC (3)
|
| 2019 | — | conf |
ICA3PP (2)
|
| 2019 | J | jnl |
J. Simulation
|
| 2019 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2019 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Ind. Manag. Data Syst.
|
| 2018 | J | jnl |
J. Intell. Manuf.
|
| 2018 | J | jnl |
Intell. Autom. Soft Comput.
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | J | jnl |
Int. J. Prod. Res.
|
| 2018 | J | jnl |
Concurr. Comput. Pract. Exp.
|
| 2017 | J | jnl |
Adv. Eng. Informatics
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | J | jnl |
Int. J. Geogr. Inf. Sci.
|
| 2016 | — | conf |
ICIRA (1)
|
| 2016 | — | conf |
ICIRA (1)
|
| 2016 | J | jnl |
Entropy
|
| 2016 | J | jnl |
Sensors
|
| 2016 | A* | conf |
MobiCom
|
| 2015 | — | conf |
EMBC
|
| 2014 | — | conf |
FSKD
|
| 2014 | J | jnl |
Signal Process.
|
| 2014 | — | conf |
ISIE
|
| 2013 | J | jnl |
Sensors
|
| 2013 | J | jnl |
Signal Process.
|
| 2013 | J | jnl |
Comput. Ind.
|
| 2013 | — | conf |
CIComms
|
| 2013 | J | jnl |
Environ. Model. Softw.
|
| 2013 | J | jnl |
Sensors
|
| 2012 | J | jnl |
Int. J. Pattern Recognit. Artif. Intell.
|
| 2011 | J | jnl |
Int. J. Comput. Intell. Syst.
|
| 2010 | C | conf |
CSCWD
|
| 2010 | — | conf |
RSKT
|
| 2010 | Misc | conf |
ICASSP
|
| 2009 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2009 | — | conf |
NEMS
|
| 2009 | — | conf |
MTV
|
| 2009 | — | conf |
ISVLSI
|
| 2008 | — | conf |
ISBI
|
| 2007 | — | conf |
MTV
|
| 2007 | — | ch. |
The Compiler Design Handbook, 2nd ed.
|
| 2007 | C | conf |
MEMOCODE
|
| 2006 | Misc | conf |
CODES+ISSS
|
| 2006 | A | conf |
DATE
|
| 2006 | — | conf |
ASAP
|
| 2006 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2006 | A* | conf |
DAC
|
| 2006 | — | conf |
EMBC
|
| 2005 | — | conf |
MTV
|
| 2005 | A* | conf |
DAC
|
| 2005 | C | conf |
ICCD
|
| 2004 | B | conf |
LCTES
|
| 2004 | Misc | conf |
CODES+ISSS
|
| 2003 | A* | conf |
DAC
|
| 2003 | A | conf |
DATE
|
| 2002 | — | ch. |
The Compiler Design Handbook
|
| 2002 | Misc | conf |
EMSOFT
|