W. D. van Driel

29 papers Journal 29
YearRankTypeTitle / Venue / Authors
2018 J jnl
A review on discoloration and high accelerated testing of optical materials in LED based-products.
Microelectron. Reliab.
M. Yazdan Mehr, Mohammad Reza Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang
2017 J jnl
Color shift acceleration on mid-power LED packages.
Microelectron. Reliab.
Guangjun Lu, W. D. van Driel, Xuejun Fan, Jiajie Fan, Cheng Qian, G. Q. Zhang
2017 J jnl
Reliability and diffusion-controlled through thickness oxidation of optical materials in LED-based products.
Microelectron. Reliab.
M. Yazdan Mehr, Mohammad Reza Toroghinejad, F. Karimzadeh, W. D. van Driel, G. Q. Zhang
2016 J jnl
Creep fatigue models of solder joints: A critical review.
Microelectron. Reliab.
Ee-Hua Wong, W. D. van Driel, Abhijit Dasgupta, Michael G. Pecht
2016 J jnl
LED degradation: From component to system.
Microelectron. Reliab.
B. Hamon, W. D. van Driel
2016 J jnl
Lumen maintenance predictions for LED packages.
Microelectron. Reliab.
W. D. van Driel, M. Schuld, B. Jacobs, F. Commissaris, J. van der Eyden, B. Hamon
2014 J jnl
Lifetime assessment of Bisphenol-A Polycarbonate (BPA-PC) plastic lens, used in LED-based products.
Microelectron. Reliab.
M. Yazdan Mehr, W. D. van Driel, Kaspar M. B. Jansen, P. Deeben, G. Q. Zhang
2014 J jnl
Multi-physics reliability simulation for solid state lighting drivers.
Microelectron. Reliab.
S. Tarashioon, W. D. van Driel, G. Q. Zhang
2012 J jnl
An approach to "Design for Reliability" in solid state lighting systems at high temperatures.
Microelectron. Reliab.
S. Tarashioon, Alessandro Baiano, Henk W. van Zeijl, C. Guo, S. W. Koh, W. D. van Driel, G. Q. Zhang
2010 J jnl
Predictive modeling of board level shock-impact reliability of the HVQFN-family.
Microelectron. Reliab.
J. de Vries, W. Balemans, W. D. van Driel
2010 J jnl
Reliability modeling on a MOSFET power package based on embedded die technology.
Microelectron. Reliab.
Dao-Guo Yang, Martien Kengen, W. G. M. Peels, David Heyes, W. D. van Driel
2009 J jnl
Advances in the drop-impact reliability of solder joints for mobile applications.
Microelectron. Reliab.
Ee-Hua Wong, S. K. W. Seah, W. D. van Driel, J. F. J. M. Caers, N. Owens, Y.-S. Lai
2008 J jnl
Correlation studies for component level ball impact shear test and board level drop test.
Microelectron. Reliab.
Ee-Hua Wong, Ranjan Rajoo, S. K. W. Seah, C. S. Selvanayagam, W. D. van Driel, J. F. J. M. Caers, X. J. Zhao, N. Owens, L. C. Tan, M. Leoni, P. L. Eu, Y.-S. Lai, C.-L. Yeh
2008 J jnl
On chip-package stress interaction.
Microelectron. Reliab.
W. D. van Driel, Dao-Guo Yang, G. Q. Zhang
2008 J jnl
Packaging influences on the reliability of MEMS resonators.
Microelectron. Reliab.
Jeroen J. M. Zaal, W. D. van Driel, S. Bendida, Q. Li, J. T. M. van Beek, G. Q. Zhang
2007 J jnl
Advanced numerical prototyping methods in modern engineering applications - Optimisation for micro-electronic package reliability.
Microelectron. Reliab.
Artur Wymyslowski, W. D. van Driel, J. van de Peer, N. Tzannetakis, G. Q. Zhang
2007 J jnl
Advanced structural similarity rules for the BGA package family.
Microelectron. Reliab.
W. D. van Driel, A. Mavinkurve, Marcel A. J. van Gils, G. Q. Zhang
2007 J jnl
Characterization of moisture properties of polymers for IC packaging.
Microelectron. Reliab.
Xiaosong Ma, Kaspar M. B. Jansen, Leo J. Ernst, W. D. van Driel, Olaf van der Sluis, G. Q. Zhang
2007 J jnl
Correlation between chemistry of polymer building blocks and microelectronics reliability.
Microelectron. Reliab.
H. J. L. Bressers, W. D. van Driel, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang
2007 J jnl
Efficient damage sensitivity analysis of advanced Cu/low-k bond pad structures by means of the area release energy criterion.
Microelectron. Reliab.
Olaf van der Sluis, R. A. B. Engelen, Richard B. R. van Silfhout, W. D. van Driel, Marcel A. J. van Gils
2007 J jnl
Facing the challenge of designing for Cu/low-k reliability.
Microelectron. Reliab.
W. D. van Driel
2007 J jnl
Measuring the through-plane elastic modulus of thin polymer films in situ.
Microelectron. Reliab.
M. van Soestbergen, Leo J. Ernst, Kaspar M. B. Jansen, W. D. van Driel
2007 J jnl
Numerical modeling of warpage induced in QFN array molding process.
Microelectron. Reliab.
Dao-Guo Yang, Kaspar M. B. Jansen, Leo J. Ernst, G. Q. Zhang, W. D. van Driel, H. J. L. Bressers, J. H. J. Janssen
2007 J jnl
On the difference between thermal cycling and thermal shock testing for board level reliability of soldered interconnections.
Microelectron. Reliab.
J. W. C. de Vries, M. Y. Jansen, W. D. van Driel
2007 J jnl
Virtual qualification of moisture induced failures of advanced packages.
Microelectron. Reliab.
Marcel A. J. van Gils, W. D. van Driel, G. Q. Zhang, H. J. L. Bressers, Richard B. R. van Silfhout, X. J. Fan, J. H. J. Janssen
2006 J jnl
Multiscale modelling of multilayer substrates.
Microelectron. Reliab.
R. L. J. M. Ubachs, Olaf van der Sluis, W. D. van Driel, G. Q. Zhang
2006 J jnl
Reliability modelling for packages in flexible end-products.
Microelectron. Reliab.
W. D. van Driel, Olaf van der Sluis, Dao-Guo Yang, R. L. J. M. Ubachs, C. Zenz, G. Aflenzer, G. Q. Zhang
2005 J jnl
Prediction of Delamination Related IC & Packaging Reliability Problems.
Microelectron. Reliab.
W. D. van Driel, Marcel A. J. van Gils, Richard B. R. van Silfhout, G. Q. Zhang
2003 J jnl
Prediction and verification of process induced warpage of electronic packages.
Microelectron. Reliab.
W. D. van Driel, G. Q. Zhang, J. H. J. Janssen, Leo J. Ernst, Fei Su, Kerm Sin Chian, Sung Yi