| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2026 | J | jnl |
CoRR
|
| 2025 | A* | conf |
ICDM
|
| 2025 | A | conf |
UAI
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2025 | B | conf |
COMPSAC
|
| 2024 | J | jnl |
Neural Comput. Appl.
|
| 2024 | — | conf |
VISIGRAPP (3): VISAPP
|
| 2024 | C | conf |
IECON
|
| 2024 | J | jnl |
Pattern Recognit.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Inf. Forensics Secur.
|
| 2024 | A* | conf |
ICLR
|
| 2024 | J | jnl |
CoRR
|
| 2023 | J | jnl |
CoRR
|
| 2023 | C | conf |
IECON
|
| 2023 | C | conf |
IECON
|
| 2022 | — | conf |
CCRIS
|
| 2022 | J | jnl |
IEEE Trans. Neural Networks Learn. Syst.
|
| 2022 | J | jnl |
Sensors
|
| 2022 | J | jnl |
Optim. Methods Softw.
|
| 2022 | — | conf |
ISIE
|
| 2022 | — | conf |
ICDL
|
| 2022 | J | jnl |
ERCIM News
|
| 2021 | — | conf |
ISCSIC
|
| 2021 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | J | jnl |
CoRR
|
| 2021 | B | conf |
ICIP
|
| 2020 | — | conf |
ISIE
|
| 2020 | J | jnl |
CoRR
|
| 2020 | C | conf |
IECON
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
Eur. J. Control
|
| 2020 | A* | conf |
NeurIPS
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2020 | J | jnl |
CoRR
|
| 2020 | — | conf |
PGM
|
| 2020 | J | jnl |
CoRR
|
| 2019 | C | conf |
IECON
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Signal Process. Lett.
|
| 2019 | C | conf |
IECON
|
| 2019 | — | conf |
ISIE
|
| 2019 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | J | jnl |
IEEE Signal Process. Lett.
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2018 | C | conf |
IECON
|
| 2018 | C | conf |
IECON
|
| 2018 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | J | jnl |
IEEE Trans. Image Process.
|
| 2017 | — | conf |
MED
|
| 2017 | C | conf |
IECON
|
| 2016 | C | conf |
IECON
|
| 2016 | C | conf |
IECON
|
| 2016 | J | jnl |
Comput. methods Biomech. Biomed. Eng. Imaging Vis.
|
| 2016 | J | jnl |
Comput. Vis. Image Underst.
|
| 2015 | J | jnl |
IEEE Trans. Medical Imaging
|
| 2015 | — | conf |
LVA/ICA
|
| 2015 | J | jnl |
IEEE Trans. Control. Syst. Technol.
|
| 2015 | J | jnl |
Comput. Sci. Inf. Syst.
|
| 2015 | C | conf |
IECON
|
| 2015 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2015 | C | conf |
IECON
|
| 2015 | — | conf |
ITSC
|
| 2015 | — | conf |
EUSIPCO
|
| 2014 | J | jnl |
Technometrics
|
| 2014 | C | conf |
IECON
|
| 2014 | — | conf |
BMEI
|
| 2014 | C | conf |
IECON
|
| 2014 | C | conf |
IECON
|
| 2014 | C | conf |
IECON
|
| 2014 | B | conf |
ICIP
|
| 2013 | C | conf |
FUSION
|
| 2013 | — | conf |
CDC
|
| 2013 | C | conf |
IECON
|
| 2013 | — | conf |
ISIE
|
| 2013 | C | conf |
IECON
|
| 2013 | J | jnl |
Autom.
|
| 2013 | C | conf |
FUSION
|
| 2013 | C | conf |
IECON
|
| 2013 | — | conf |
ISIE
|
| 2013 | C | conf |
IECON
|
| 2013 | — | conf |
ECML/PKDD (2)
|
| 2012 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2012 | — | conf |
ISBI
|
| 2012 | — | conf |
SSP
|
| 2012 | C | conf |
IECON
|
| 2012 | — | conf |
CDC
|
| 2011 | — | conf |
EUSIPCO
|
| 2011 | Misc | conf |
ICASSP
|
| 2010 | — | conf |
EUSIPCO
|
| 2010 | C | conf |
FUSION
|
| 2010 | — | conf |
ISGT Europe
|
| 2010 | C | conf |
FUSION
|
| 2008 | — | conf |
ICINCO-ICSO
|
| 2008 | C | conf |
ACC
|
| 2008 | J | jnl |
IEEE Trans. Signal Process.
|
| 2007 | — | conf |
ICASSP (3)
|
| 2007 | J | jnl |
Comput. Stat. Data Anal.
|
| 2006 | — | conf |
ICASSP (3)
|
| 2005 | — | conf |
SOAS
|
| 2005 | J | jnl |
IEEE Trans. Signal Process.
|
| 2005 | J | jnl |
Syst. Control. Lett.
|
| 2005 | — | conf |
ICASSP (4)
|
| 2001 | — | conf |
IPMI
|