Vincent Fiori - RankMe

11 papers Journal 7Unranked 4

Year	Rank	Type	Title / Venue / Authors
2016	J	`jnl`	Experimental Insights Into Thermal Dissipation in TSV-Based 3-D Integrated Circuits. IEEE Des. Test Perceval Coudrain, Papa Momar Souare, Rafael Prieto, Vincent Fiori, Alexis Farcy, Laurent Le Pailleur, Jean-Philippe Colonna, Cristiano Santos, Pascal Vivet, M. Haykel Ben Jamaa, Denis Dutoit, François de Crecy, Sylvain Dumas, Christian Chancel, Didier Lattard, Séverine Cheramy
2016	J	`jnl`	Wafer level measurements and numerical analysis of self-heating phenomena in nano-scale SOI MOSFETs. Microelectron. Reliab. Giacomo Garegnani, Vincent Fiori, Gilles Gouget, Frederic Monsieur, Clément Tavernier
2015	J	`jnl`	Qualification of bumping processes: Experimental and numerical investigations on mechanical stress and failure modes induced by shear test. Microelectron. Reliab. Sébastien Gallois-Garreignot, Naceur Benzima, Etienne Benmussa, Caroline Moutin, Pierre-Olivier Bouchard, Vincent Fiori, Clément Tavernier
2015	—	`conf`	Stress management strategy to limit die curvature during silicon interposer integration. 3DIC Benjamin Vianne, Alexis Farcy, Vincent Fiori, Cédrick Chappaz, Norbert Chevrier, G. Lobascio, Pascal Chausse, F. Ponthenier, A. Ruckly, Stéphanie Escoubas, Olivier Thomas
2015	J	`jnl`	Thermo-mechanical characterization of passive stress sensors in Si interposer. Microelectron. Reliab. Benjamin Vianne, Pierre Bar, Vincent Fiori, Sébastien Gallois-Garreignot, Komi-Atchou Ewuame, Pascal Chausse, Stéphanie Escoubas, Nicolas Hotellier, Olivier Thomas
2014	J	`jnl`	Numerical analysis of thermo-mechanical and mobility effects for 28 nm node and beyond: Comparison and design consequences over bumping technologies. Microelectron. Reliab. Vincent Fiori, Komi-Atchou Ewuame, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier
2014	—	`conf`	Using TSVs for thermal mitigation in 3D circuits: Wish and truth. 3DIC Cristiano Santos, Papa Momar Souare, François de Crecy, Perceval Coudrain, Jean-Philippe Colonna, Pascal Vivet, Andras Borbely, Ricardo Reis, M. Haykel Ben Jamaa, Vincent Fiori, Alexis Farcy
2013	J	`jnl`	Strain engineering for bumping over IPs: Numerical investigations of thermo-mechanical stress induced mobility variations for CMOS 32 nm and beyond. Microelectron. Reliab. Vincent Fiori, Sébastien Gallois-Garreignot, Hervé Jaouen, Clément Tavernier
2013	—	`conf`	Thermal correlation between measurements and FEM simulations in 3D ICs. 3DIC Papa Momar Souare, François de Crecy, Vincent Fiori, M. Haykel Ben Jamaa, Alexis Farcy, Sébastien Gallois-Garreignot, Andras Borbely, Jean-Philippe Colonna, Perceval Coudrain, B. Giraud, C. Laviron, Séverine Cheramy, Clément Tavernier, Jean Michailos
2013	—	`conf`	Thermo-mechanical study of a 2.5D passive silicon interposer technology: Experimental, numerical and In-Situ stress sensors developments. 3DIC Benjamin Vianne, Pierre Bar, Vincent Fiori, Sebastien Petitdidier, Norbert Chevrier, Sébastien Gallois-Garreignot, Alexis Farcy, Pascal Chausse, Stéphanie Escoubas, Nicolas Hotellier, Olivier Thomas
2010	J	`jnl`	Fracture phenomena induced by Front-End/Back-End interactions: Dedicated failure analysis and numerical developments. Microelectron. Reliab. Sébastien Gallois-Garreignot, Vincent Fiori, D. Nelias