Valeriy Sukharev

38 papers A* 4A 8Journal 9Unranked 17

Year	Rank	Type	Title / Venue / Authors
2025	—	`conf`	A Physics-Based Electromigration Assessment of Analog Circuits. IRPS Jun-Ho Choy, Armen Kteyan, R. Kang, S. Jo, Valeriy Sukharev, S. Choi, J. Passage, I. Kühn, Markus Herklotz, M. Gall
2025	—	`conf`	Electromigration Assessment in Power Grids with Account of Non-Uniform Temperature Distribution. IRPS Armen Kteyan, J. Choy, Valeriy Sukharev, Stéphane Moreau, Y. Yi, R. Bloom, C. Kim
2024	—	`conf`	A Novel Method for the Determination of Electromigration-Induced Void Nucleation Stresses. IRPS J. Shuster-Passage, S. Abdel Razek, M. Mattoo, Meike Hauschildt, Seungman Choi, Martin Gall, Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Matthias Kraatz, J. R. Lloyd
2024	—	`conf`	A Unified Physics-Based Stochastic Model for EM-Induced Resistance Degradation in BEoL Interconnect Segments. IRPS Valeriy Sukharev, Jun-Ho Choy, Armen Kteyan, J. Shuster-Passage, Seungman Choi, Martin Gall
2024	—	`conf`	Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis. IRPS Yong Hyeon Yi, Chris H. Kim, Armen Kteyan, Alexander Volkov, Stéphane Moreau, Valeriy Sukharev
2024	—	`conf`	Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects. ISPD Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan
2023	—	`conf`	Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution. ISPD Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau
2023	—	`conf`	Studying the Impact of Temperature Gradient on Electromigration Lifetime Using a Power Grid Test Structure with On-Chip Heaters. IRPS Yong Hyeon Yi, Chris H. Kim, Chen Zhou, Armen Kteyan, Valeriy Sukharev
2022	J	`jnl`	Experimental Validation of a Novel Methodology for Electromigration Assessment in On-Chip Power Grids. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Valeriy Sukharev, Armen Kteyan, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Jun-Ho Choy, Sofya Torosyan, Yu Zhu
2022	—	`conf`	Novel Methodology for Assessing Chip-Package Interaction Effects onChip Performance. ISPD Armen Kteyan, Jun-Ho Choy, Valeriy Sukharev, Massimo Bertoletti, Carmelo Maiorca, Rossana Zadra, Massimo Inzaghi, Gabriele Gattere, Giancarlo Zinco, Paolo Valente, Roberto Bardelli, Alessandro Valerio, Pierluigi Rolandi, Mattia Monetti, Valentina Cuomo, Salvatore Santapa
2022	—	`conf`	Novel methodology for temperature-aware electromigration assessment in on-chip power grid: simulations and experimental validation (Invited). IRPS Armen Kteyan, Valeriy Sukharev, Y. Yi, Chris H. Kim
2020	A	`conf`	Electromigration Checking Using a Stochastic Effective Current Model. ICCAD Adam Issa, Valeriy Sukharev, Farid N. Najm
2019	—	`conf`	An Accurate Assessment of Chip-Package Interaction is a Key Factor for Designing Resilient 3D IC Systems. 3DIC Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy
2019	—	`conf`	Assesment of CPI Stress Impact on IC Reliability and Performance in 2.5D/3D Packages. IRPS Armen Kteyan, Henrik Hovsepyan, Jun-Ho Choy, Valeriy Sukharev
2019	—	`conf`	Efficient Simulation of Electromigration Damage in Large Chip Power Grids Using Accurate Physical Models (Invited Paper). IRPS Farid N. Najm, Valeriy Sukharev
2019	A	`conf`	Power Grid Fixing for Electromigration-induced Voltage Failures. ICCAD Zahi Moudallal, Valeriy Sukharev, Farid N. Najm
2018	J	`jnl`	Power Grid Electromigration Checking Using Physics-Based Models. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm
2017	J	`jnl`	Dynamic electromigration modeling for transient stress evolution and recovery under time-dependent current and temperature stressing. Integr. Xin Huang, Valeriy Sukharev, Taeyoung Kim, Sheldon X.-D. Tan
2017	A	`conf`	Fast physics-based electromigration assessment by efficient solution of linear time-invariant (LTI) systems. ICCAD Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm
2016	J	`jnl`	Analytical Modeling and Characterization of Electromigration Effects for Multibranch Interconnect Trees. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Taeyoung Kim, Valeriy Sukharev
2016	J	`jnl`	Electromigration assessment for power grid networks considering temperature and thermal stress effects. Integr. Xin Huang, Valeriy Sukharev, Jun-Ho Choy, Marko Chew, Taeyoung Kim, Sheldon X.-D. Tan
2016	—	`conf`	Electromigration recovery modeling and analysis under time-dependent current and temperature stressing. ASP-DAC Xin Huang, Valeriy Sukharev, Taeyoung Kim, Hai-Bao Chen, Sheldon X.-D. Tan
2016	A	`conf`	Fast physics-based electromigration checking for on-die power grids. ICCAD Sandeep Chatterjee, Valeriy Sukharev, Farid N. Najm
2016	A	`conf`	Learning-based dynamic reliability management for dark silicon processor considering EM effects. DATE Taeyoung Kim, Xin Huang, Hai-Bao Chen, Valeriy Sukharev, Sheldon X.-D. Tan
2016	J	`jnl`	Physics-Based Electromigration Models and Full-Chip Assessment for Power Grid Networks. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Xin Huang, Armen Kteyan, Sheldon X.-D. Tan, Valeriy Sukharev
2016	A*	`conf`	Physics-based full-chip TDDB assessment for BEOL interconnects. DAC Xin Huang, Valeriy Sukharev, Zhongdong Qi, Taeyoung Kim, Sheldon X.-D. Tan
2015	A*	`conf`	Interconnect reliability modeling and analysis for multi-branch interconnect trees. DAC Hai-Bao Chen, Sheldon X.-D. Tan, Valeriy Sukharev, Xin Huang, Taeyoung Kim
2015	—	`conf`	New electromigration modeling and analysis considering time-varying temperature and current densities. ASP-DAC Hai-Bao Chen, Sheldon X.-D. Tan, Xin Huang, Valeriy Sukharev
2015	A	`conf`	Post placement leakage reduction with stress-enhanced filler cells. ISLPED Jun-Ho Choy, Valeriy Sukharev, Armen Kteyan, Henrik Hovsepyan, Ramnath Venkatraman, Ruggero Castagnetti
2014	A	`conf`	IR-drop based electromigration assessment: parametric failure chip-scale analysis. ICCAD Valeriy Sukharev, Xin Huang, Hai-Bao Chen, Sheldon X.-D. Tan
2014	A	`conf`	Lifetime optimization for real-time embedded systems considering electromigration effects. ICCAD Taeyoung Kim, Bowen Zheng, Hai-Bao Chen, Qi Zhu, Valeriy Sukharev, Sheldon X.-D. Tan
2014	A*	`conf`	Physics-based Electromigration Assessment for Power Grid Networks. DAC Xin Huang, Tan Yu, Valeriy Sukharev, Sheldon X.-D. Tan
2012	J	`jnl`	Multi-scale Simulation Methodology for Stress Assessment in 3D IC: Effect of Die Stacking on Device Performance. J. Electron. Test. Valeriy Sukharev, Armen Kteyan, Jun-Ho Choy, Henrik Hovsepyan, Ara Markosian, Ehrenfried Zschech, Rene Huebner
2010	A*	`conf`	Closed-form modeling of layout-dependent mechanical stress. DAC Vivek Joshi, Valeriy Sukharev, Andres Torres, Kanak Agarwal, Dennis Sylvester, David T. Blaauw
2009	—	`conf`	Control of design specific variation in etch-assisted via pattern transfer by means of full-chip simulation. ISQED Valeriy Sukharev, Ara Markosian, Armen Kteyan, Levon Manukyan, Nikolay Khachatryan, Jun-Ho Choy, Hasmik Lazaryan, Henrik Hovsepyan, Seiji Onoue, Takuo Kikuchi, Tetsuya Kamigaki
2005	J	`jnl`	Physically based simulation of electromigration-induced degradation mechanisms in dual-inlaid copper interconnects. IEEE Trans. Comput. Aided Des. Integr. Circuits Syst. Valeriy Sukharev
2004	—	`conf`	Physically-Based Simulation of Electromigration Induced Failures in Copper Dual-Damascene Interconnect. ISQED Valeriy Sukharev
2001	J	`jnl`	Reliability Studies on Multilevel Interconnection with Intermetal Dielectric Air Gaps. Microelectron. Reliab. Valeriy Sukharev, Ben P. Shieh, Ratan K. Choudhury, Chong W. Park, Krishna C. Saraswat