Uwe Kerst

14 papers A 2C 1Journal 9Unranked 2
YearRankTypeTitle / Venue / Authors
2015 — conf
A BIST structure for the evaluation of the MOSFET gate dielectric interface state density in post-processed CMOS chips.
ESSCIRC
Norman Dodel, Stefan Keil, Andreas Wiemhofer, Malte Kortstock, Philipp Scholz, Uwe Kerst, Roland Thewes
2014 J jnl
Efficient and flexible Focused Ion Beam micromachining of Solid Immersion Lenses in various bulk semiconductor materials - An adaptive calibration algorithm.
Microelectron. Reliab.
Philipp Scholz, Norbert Herfurth, Michael Sadowski, Ted R. Lundquist, Uwe Kerst, Christian Boit
2013 C conf
Security Risks Posed by Modern IC Debug and Diagnosis Tools.
FDTC
Christian Boit, Clemens Helfmeier, Uwe Kerst
2012 — conf
On charge sensors for FIB attack detection.
HOST
Clemens Helfmeier, Christian Boit, Uwe Kerst
2010 J jnl
Extraction of local thin-film solar cell parameters by bias-dependent IR-LBIC.
Microelectron. Reliab.
Mahyar Boostandoost, Uwe Kerst, Christian Boit
2010 J jnl
Optimizing focused ion beam created solid immersion lenses in bulk silicon using design of experiments.
Microelectron. Reliab.
Philipp Scholz, Christian Gallrapp, Uwe Kerst, Ted R. Lundquist, Christian Boit
2009 J jnl
Physical analysis, trimming and editing of nanoscale IC function with backside FIB processing.
Microelectron. Reliab.
Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Ted R. Lundquist, Peter Egger, Christian Boit
2008 J jnl
Comparison of laser voltage probing and mapping results in oversized and minimum size devices of 120 nm and 65 nm technology.
Microelectron. Reliab.
Ulrike Kindereit, Christian Boit, Uwe Kerst, Steven Kasapi, Radu Ispasoiu, Roy Ng, William K. Lo
2008 J jnl
Physical Techniques for Chip-Backside IC Debug in Nanotechnologies.
IEEE Des. Test Comput.
Christian Boit, Rudolf Schlangen, Uwe Kerst, Ted R. Lundquist
2007 A conf
Backside E-Beam Probing on Nano scale devices.
ITC
Rudolf Schlangen, Reiner Leihkauf, Uwe Kerst, Christian Boit, Rajesh Jain, Tahir Malik, Keneth R. Wilsher, Ted R. Lundquist, Bernd Krüger
2007 J jnl
Non destructive 3D chip inspection with nano scale potential by use of backside FIB and backscattered electron microscopy.
Microelectron. Reliab.
Rudolf Schlangen, Uwe Kerst, Christian Boit, Tahir Malik, Rajesh Jain, Ted R. Lundquist
2006 J jnl
Contact to contacts or silicide by use of backside FIB circuit edit allowing to approach every active circuit node.
Microelectron. Reliab.
Rudolf Schlangen, Peter Sadewater, Uwe Kerst, Christian Boit
2005 J jnl
Electrical Performance Evaluation of FIB Edited Circuits through Chip Backside Exposing Shallow Trench Isolations.
Microelectron. Reliab.
Rudolf Schlangen, Uwe Kerst, A. Kabakow, Christian Boit
2005 A conf
Impact of back side circuit edit on active device performance in bulk silicon ICs.
ITC
Uwe Kerst, Rudolf Schlangen, A. Kabakow, Erwan Le Roy, Ted R. Lundquist, Siegfried Pauthner