Umamaheswara Rao Tida

26 papers A 2C 1Journal 12Unranked 11
YearRankTypeTitle / Venue / Authors
2026 J jnl
CQ-CiM: Hardware-Aware Embedding Shaping for Robust CiM-Based Retrieval.
CoRR
Xinzhao Li, Alptekin Vardar, Franz Müller, Navya Goli, Umamaheswara Rao Tida, Kai Ni, X. Sharon Hu, Thomas Kämpfe, Ruiyang Qin
2025 — conf
Machine Learning Assisted Magnetic-Core Coupled Inductor Design for Interleaved Buck Converter.
ISQED
Maliha Elma, Navya Goli, Umamaheswara Rao Tida
2024 — conf
Compact 6T-SRAM Using Bottom-Gate Transistor in FD-SOI Process for Monolithic-3D Integration.
ISVLSI
Madhava Sarma Vemuri, Tanvir Ahmed, Umamaheswara Rao Tida
2024 — conf
Design Approaches and Consideration for a Reliable and Efficient Monolithic 3D Integration.
ISVLSI
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2024 J jnl
Modeling and Design of Dual-Purpose MIV in Monolithic 3D IC.
IEEE Access
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 J jnl
Design, Analysis and Optimization of Magnetic-Core Solenoid Inductor for On-Chip Multi-Phase Buck Converter.
IEEE Access
Maliha Elma, Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 — conf
Efficient and Scalable MIV-Transistor with Extended Gate in Monolithic 3D Integration.
MWSCAS
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 J jnl
Efficient and Scalable MIV-transistor with Extended Gate in Monolithic 3D Integration.
CoRR
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 — conf
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration.
SOCC
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 J jnl
FDSOI Process Based MIV-transistor Utilization for Standard Cell Designs in Monolithic 3D Integration.
CoRR
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 — conf
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration.
ISQED
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 J jnl
Metal Inter-layer Via Keep-out-zone in M3D IC: A Critical Process-aware Design Consideration.
CoRR
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2023 C conf
Small Footprint 6T-SRAM Design with MIV-Transistor Utilization in M3D-IC Technology.
ICCD
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2022 J jnl
Magnetic Core TSV-Inductor Design and Optimization for On-chip DC-DC Converter.
ACM Trans. Design Autom. Electr. Syst.
Chenyi Wen, Xiao Dong, Baixin Chen, Umamaheswara Rao Tida, Yiyu Shi, Cheng Zhuo
2020 J jnl
An Improved Quadrature Voltage-Controlled Oscillator with Through-Silicon-Via Inductor in Three-dimensional Integrated Circuits.
CoRR
Dawei Li, Madhava Sarma Vemuri, Umamaheswara Rao Tida
2020 — conf
Design and Optimization of Magnetic-core Solenoid Inductor for Multi-phase Buck Converter.
MWSCAS
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2020 — conf
Dual-Purpose Metal Inter-layer Via Utilization in Monolithic Three-Dimensional (M3D) Integration.
MWSCAS
Madhava Sarma Vemuri, Umamaheswara Rao Tida
2020 J jnl
Dynamic Frequency Scaling Aware Opportunistic Through-Silicon-Via Inductor Utilization in Resonant Clocking.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Umamaheswara Rao Tida, Cheng Zhuo, Leibo Liu, Yiyu Shi
2020 — conf
Efficient Metal Inter-Layer Via Utilization Strategies for Three-dimensional Integrated Circuits.
SoCC
Umamaheswara Rao Tida, Madhava Sarma Vemuri
2019 J jnl
Single-Inductor-Multiple-Tier Regulation: TSV-Inductor-Based On-Chip Buck Converters for 3-D IC Power Delivery.
IEEE Trans. Very Large Scale Integr. Syst.
Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi
2018 A conf
Modeling and optimization of magnetic core TSV-inductor for on-chip DC-DC converter.
ICCAD
Baixin Chen, Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi
2015 J jnl
On the Efficacy of Through-Silicon-Via Inductors.
IEEE Trans. Very Large Scale Integr. Syst.
Umamaheswara Rao Tida, Rongbo Yang, Cheng Zhuo, Yiyu Shi
2014 — conf
"Green" On-chip Inductors in Three-Dimensional Integrated Circuits.
ISVLSI
Umamaheswara Rao Tida, Varun Mittapalli, Cheng Zhuo, Yiyu Shi
2014 J jnl
Novel Through-Silicon-Via Inductor-Based On-Chip DC-DC Converter Designs in 3D ICs.
ACM J. Emerg. Technol. Comput. Syst.
Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi
2014 A conf
Opportunistic through-silicon-via inductor utilization in LC resonant clocks: concept and algorithms.
ICCAD
Umamaheswara Rao Tida, Varun Mittapalli, Cheng Zhuo, Yiyu Shi
2014 — conf
Through-silicon-via inductor: Is it real or just a fantasy?
ASP-DAC
Umamaheswara Rao Tida, Cheng Zhuo, Yiyu Shi