| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
SII
|
| 2025 | — | conf |
ICM
|
| 2025 | — | conf |
ICM
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ICIT
|
| 2025 | — | conf |
ICM
|
| 2024 | — | conf |
ISIE
|
| 2024 | — | conf |
BioRob
|
| 2024 | — | conf |
AMC
|
| 2024 | — | conf |
AMC
|
| 2024 | — | conf |
AMC
|
| 2024 | — | conf |
ISIE
|
| 2024 | — | conf |
AMC
|
| 2023 | — | conf |
EMBC
|
| 2023 | — | conf |
ICM
|
| 2023 | J | jnl |
IEEE Access
|
| 2023 | — | conf |
ISIE
|
| 2023 | J | jnl |
Lumped Parameter Thermal Model of Heat-Generating General Geometry in Cylindrical Coordinate System.
IEEE Access
|
| 2023 | — | conf |
ISIE
|
| 2023 | C | conf |
Position-and-Force-Sensorless Control Considering Equivalent Mass Matrix and Cross-Coupling Factors.
IECON
|
| 2023 | — | conf |
ICM
|
| 2023 | — | conf |
ISIE
|
| 2022 | C | conf |
IECON
|
| 2022 | C | conf |
IECON
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
ICM
|
| 2021 | — | conf |
AMC
|
| 2021 | — | conf |
ICM
|
| 2021 | — | conf |
AMC
|
| 2021 | — | conf |
ICM
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
AMC
|
| 2021 | — | conf |
AMC
|
| 2021 | — | conf |
AMC
|
| 2021 | — | conf |
ISIE
|
| 2021 | — | conf |
ISIE
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
AMC
|
| 2020 | — | conf |
AMC
|
| 2020 | C | conf |
IECON
|
| 2020 | C | conf |
IECON
|
| 2020 | — | conf |
AMC
|
| 2020 | — | conf |
ICIT
|
| 2020 | C | conf |
IECON
|
| 2020 | — | conf |
AMC
|
| 2020 | — | conf |
AMC
|
| 2020 | — | conf |
ICIT
|
| 2020 | — | conf |
ICIT
|
| 2020 | C | conf |
IECON
|
| 2020 | C | conf |
IECON
|
| 2020 | — | conf |
ICIT
|
| 2020 | J | jnl |
J. Robotics Mechatronics
|
| 2020 | — | conf |
ICIT
|
| 2019 | — | conf |
SII
|
| 2019 | — | conf |
ICM
|
| 2019 | — | conf |
ICIT
|
| 2019 | — | conf |
ICIT
|
| 2019 | — | conf |
ICM
|
| 2019 | C | conf |
IECON
|
| 2019 | — | conf |
ICIT
|
| 2019 | C | conf |
IECON
|
| 2019 | — | conf |
EMBC
|
| 2019 | C | conf |
IECON
|
| 2019 | — | conf |
ICM
|
| 2019 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2019 | C | conf |
IECON
|
| 2019 | C | conf |
IECON
|
| 2019 | C | conf |
IECON
|
| 2019 | — | conf |
ICM
|
| 2019 | J | jnl |
Adv. Robotics
|
| 2019 | — | conf |
ICM
|
| 2018 | — | conf |
AMC
|
| 2018 | J | jnl |
Adv. Robotics
|
| 2018 | C | conf |
INDIN
|
| 2018 | — | conf |
AIM
|
| 2018 | — | conf |
ISIE
|
| 2018 | C | conf |
IECON
|
| 2018 | — | conf |
ISIE
|
| 2018 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2018 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2018 | C | conf |
IECON
|
| 2018 | C | conf |
IECON
|
| 2018 | C | conf |
IECON
|
| 2018 | C | conf |
INDIN
|
| 2018 | C | conf |
INDIN
|
| 2018 | C | conf |
IECON
|
| 2018 | C | conf |
IECON
|
| 2017 | — | conf |
M2VIP
|
| 2017 | C | conf |
IECON
|
| 2017 | — | conf |
M2VIP
|
| 2017 | — | conf |
M2VIP
|
| 2017 | — | conf |
ISIE
|
| 2017 | — | conf |
ICM
|
| 2016 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2016 | C | conf |
IECON
|
| 2016 | C | conf |
IECON
|
| 2016 | — | conf |
AMC
|
| 2016 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2016 | C | conf |
IECON
|
| 2016 | C | conf |
IECON
|
| 2016 | C | conf |
IECON
|
| 2016 | — | conf |
AMC
|
| 2016 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2016 | — | conf |
AMC
|
| 2016 | — | conf |
AMC
|
| 2016 | — | conf |
AMC
|
| 2016 | C | conf |
IECON
|
| 2016 | C | conf |
IECON
|
| 2016 | — | conf |
AMC
|
| 2016 | C | conf |
IECON
|
| 2016 | — | conf |
ISIE
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
IECON
|
| 2015 | C | conf |
INDIN
|
| 2015 | C | conf |
IECON
|
| 2015 | — | conf |
ICM
|
| 2015 | C | conf |
IECON
|
| 2015 | — | conf |
ICAR
|
| 2015 | J | jnl |
J. Intell. Robotic Syst.
|
| 2015 | — | conf |
ICM
|
| 2014 | — | conf |
AMC
|
| 2014 | — | conf |
AMC
|
| 2014 | C | conf |
IECON
|
| 2014 | — | conf |
AMC
|
| 2014 | — | conf |
AMC
|
| 2014 | — | conf |
AMC
|
| 2014 | C | conf |
IECON
|
| 2014 | — | conf |
AMC
|
| 2014 | — | conf |
AMC
|
| 2014 | — | conf |
AMC
|
| 2014 | J | jnl |
Adv. Robotics
|
| 2014 | C | conf |
IECON
|
| 2014 | — | conf |
ISIE
|
| 2013 | — | conf |
ISIE
|
| 2013 | C | conf |
IECON
|
| 2013 | — | conf |
ICM
|
| 2013 | — | conf |
ICAR
|
| 2013 | — | conf |
ICM
|
| 2013 | — | conf |
ISIE
|
| 2013 | C | conf |
IECON
|
| 2013 | C | conf |
IECON
|
| 2012 | C | conf |
IECON
|
| 2012 | C | conf |
IECON
|
| 2012 | — | conf |
AMC
|
| 2012 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2012 | — | conf |
AMC
|
| 2011 | J | jnl |
Int. J. Autom. Technol.
|
| 2010 | J | jnl |
Int. J. Intell. Syst. Technol. Appl.
|
| 2010 | — | conf |
AMC
|
| 2010 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2010 | — | conf |
AMC
|
| 2010 | — | conf |
AMC
|
| 2010 | — | conf |
AMC
|
| 2010 | — | conf |
AMC
|
| 2010 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2010 | — | conf |
AMC
|
| 2009 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2009 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2009 | A | conf |
IROS
|
| 2009 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2009 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2008 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2008 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2008 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2008 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2008 | A | conf |
IROS
|
| 2008 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2008 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2005 | C | conf |
CCA
|
| 2004 | C | conf |
CCA
|
| 2002 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2000 | J | jnl |
J. Robotics Mechatronics
|
| 1996 | J | jnl |
J. Robotics Mechatronics
|
| 1996 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 1995 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 1993 | — | ch. |
Robotics, Mechatronics and Manufacturing Systems
|
| 1993 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 1992 | J | jnl |
Adv. Robotics
|
| 1988 | A | conf |
IROS
|