Toni T. Mattila

11 papers Journal 11
YearRankTypeTitle / Venue / Authors
2014 J jnl
An approach to adjust the board-level drop test conditions to improve the correlation with product-level drop impact.
Microelectron. Reliab.
Toni T. Mattila, Heikki Ruotoistenmäki, Jani Raami, Jussi Hokka, Manu Mäkelä, Esa Hussa, Markku Sillanpää, Ville Halkola
2014 J jnl
Evaluation of the drop response of handheld electronic products.
Microelectron. Reliab.
Toni T. Mattila, Laura Vajavaara, Jussi Hokka, Esa Hussa, Manu Mäkelä, Ville Halkola
2014 J jnl
Reliability assessment of a MEMS microphone under mixed flowing gas environment and shock impact loading.
Microelectron. Reliab.
Jue Li, Mikael Broas, Jani Raami, Toni T. Mattila, Mervi Paulasto-Kröckel
2012 J jnl
On the effects of temperature on the drop reliability of electronic component boards.
Microelectron. Reliab.
Toni T. Mattila, Jue Li, Jorma K. Kivilahti
2012 J jnl
Shock impact reliability characterization of a handheld product in accelerated tests and use environment.
Microelectron. Reliab.
Juha Karppinen, Jue Li, J. Pakarinen, Toni T. Mattila, Mervi Paulasto-Kröckel
2012 J jnl
The reliability of component boards studied with different shock impact repetition frequencies.
Microelectron. Reliab.
Jussi Hokka, Jue Li, Toni T. Mattila, Mervi Paulasto-Kröckel
2011 J jnl
Toward comprehensive reliability assessment of electronics by a combined loading approach.
Microelectron. Reliab.
Toni T. Mattila, Mervi Paulasto-Kröckel
2010 J jnl
A novel impact test system for more efficient reliability testing.
Microelectron. Reliab.
Jussi Hokka, Toni T. Mattila, Jue Li, Jarmo Teeri, Jorma K. Kivilahti
2010 J jnl
FEM simulations for reliability assessment of component boards drop tested at various temperatures.
Simul. Model. Pract. Theory
J. Li, Toni T. Mattila, H. Xu, Mervi Paulasto
2010 J jnl
Thermomechanical reliability characterization of a handheld product in accelerated tests and use environment.
Microelectron. Reliab.
Juha Karppinen, Jue Li, Toni T. Mattila, Mervi Paulasto-Kröckel
2007 J jnl
Evolution of microstructure and failure mechanism of lead-free solder interconnections in power cycling and thermal shock tests.
Microelectron. Reliab.
Tomi Laurila, Toni T. Mattila, Vesa Vuorinen, Juha Karppinen, Jue Li, Mika Sippola, Jorma K. Kivilahti