Tong An

14 papers C 1Journal 11Unranked 2
YearRankTypeTitle / Venue / Authors
2024 J jnl
Study on a Simulation Method for IGBT Bonded Wire Cracking Under Power Cycling Conditions Considering the Effect of Damage Evolution.
IEEE Access
Shengjun Zhao, Qi Wang, Tong An, Fei Qin
2023 J jnl
A Security Resilience Metric Framework Based on the Evolution of Attack and Defense Scenarios.
IEEE Internet Things J.
Jinxin Zuo, Ziyu Guo, Tong An, Zhongwei Xu, Yueming Lu
2023 J jnl
Dual-mode active noise control system with on-line identification of secondary path.
Multim. Tools Appl.
Tao Zhang, Tong An, Yanzhang Geng, Zhongzheng Liu, Xin Zhao, Shuang Li
2022 — conf
New Generation Power System Security Protection Technology Based on Dynamic Defense.
ICAIS (3)
Xiaowei Chen, HeFang Jiang, Shaocheng Wu, Tao Liu, Tong An, Zhongwei Xu, Man Zhang, Muhammad Shafiq
2021 J jnl
An Experimental Evaluation and Investigation of Waves of Misery in R-trees.
CoRR
Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref
2021 J jnl
An Experimental Evaluation and Investigation of Waves of Misery in R-trees.
Proc. VLDB Endow.
Lu Xing, Eric Lee, Tong An, Bo-Cheng Chu, Ahmed Mahmood, Ahmed M. Aly, Jianguo Wang, Walid G. Aref
2021 J jnl
Normalized Combinations of Proportionate Affine Projection Sign Subband Adaptive Filter.
Sci. Program.
Tong An, Tao Zhang, Yanzhang Geng, Hai-Quan Jiao
2021 — conf
Underwater Wireless High-Efficiency Energy Transmission Method Based on the Ultrasonic Transducer Array.
ICCT
Zhongzheng Liu, Tao Zhang, Yanzhang Geng, Tong An
2018 J jnl
Failure study of Sn37Pb PBGA solder joints using temperature cycling, random vibration and combined temperature cycling and random vibration tests.
Microelectron. Reliab.
Tong An, Chao Fang, Fei Qin, Huaicheng Li, Tao Tang, Pei Chen
2018 J jnl
The experimental analysis and the mechanical model for the debonding failure of TSV-Cu/Si interface.
Microelectron. Reliab.
Si Chen, Zhizhe Wang, Yunfei En, Yun Huang, Fei Qin, Tong An
2016 J jnl
Protrusion of electroplated copper filled in through silicon vias during annealing process.
Microelectron. Reliab.
Si Chen, Fei Qin, Tong An, Pei Chen, Bin Xie, Xunqing Shi
2014 J jnl
Effects of the intermetallic compound microstructure on the tensile behavior of Sn3.0Ag0.5Cu/Cu solder joint under various strain rates.
Microelectron. Reliab.
Tong An, Fei Qin
2011 J jnl
Mechanical behavior of solder joints under dynamic four-point impact bending.
Microelectron. Reliab.
Tong An, Fei Qin, Jiangang Li
2005 C conf
Hamiltonian-like Properties of k-Ary n-Cubes.
PDCAT
Deqiang Wang, Mingyang Pan, Tong An, Kelun Wang, Shuyan Qu