Tomohiro Shimizu

16 papers Journal 2Unranked 14
YearRankTypeTitle / Venue / Authors
2024 — conf
Electrochemical Biosensor Using Methylene Blue as an Electrochemical Mediator Coupling with DNA Aptamer.
IEEE SENSORS
Koki Yamashita, Tomohiro Shimizu, Shoso Shingubara, Hitoshi Ishida, Akinori Kuzuya, Takeshi Ito
2024 — conf
TSV Formation Using a Direct CU Electroplating on Electroless Plated Barrier Layer with a Low Resistivity.
3DIC
Yuko Ishii, Takanobu Hamamura, Tomohiro Shimizu, Takeshi Ito, Shoso Shingubara
2023 J jnl
Deep Selection: A Fully Supervised Camera Selection Network for Surgery Recordings.
CoRR
Ryo Hachiuma, Tomohiro Shimizu, Hideo Saito, Hiroki Kajita, Yoshifumi Takatsume
2021 J jnl
Hand Motion-Aware Surgical Tool Localization and Classification from an Egocentric Camera.
J. Imaging
Tomohiro Shimizu, Ryo Hachiuma, Hiroki Kajita, Yoshifumi Takatsume, Hideo Saito
2020 — conf
Deep Selection: A Fully Supervised Camera Selection Network for Surgery Recordings.
MICCAI (3)
Ryo Hachiuma, Tomohiro Shimizu, Hideo Saito, Hiroki Kajita, Yoshifumi Takatsume
2020 — conf
Development of a Person Search Components Based on an Omnidirectional Camera and a 3D-LiDAR.
SICE
Ayuka Yoshida, Tomohiro Shimizu, Tomoyuki Ohkubo, Kazuyuki Kobayashi, Kajiro Watanabe
2020 — conf
Surgery Recording without Occlusions by Multi-view Surgical Videos.
VISIGRAPP (5: VISAPP)
Tomohiro Shimizu, Kei Oishi, Ryo Hachiuma, Hiroki Kajita, Yoshifumi Takatsume, Hideo Saito
2019 — conf
Automatic Viewpoint Switching for Multi-view Surgical Videos.
ISMAR Adjunct
Tomohiro Shimizu, Kei Oishi, Hideo Saito, Hiroki Kajita, Yoshifumi Takatsume
2019 — conf
Cu Diffusion Barrier Properties of Various CoWB Electroless Plated Films on SiO2/Si Substrate for Via-last TSV Application.
3DIC
Taro Matsudaira, Shunsuke Shindo, Tomohiro Shimizu, Takeshi Ito, Shoso Shinguhara, Satoru Shimizu
2019 — conf
Prediction of Future Shot Direction using Pose and Position of Tennis Player.
MMSports@MM
Tomohiro Shimizu, Ryo Hachiuma, Hideo Saito, Takashi Yoshikawa, Chonho Lee
2019 — conf
Study of MacEtch using Additives for Preparation of TSV.
3DIC
Shunsuke Hanatani, Takuya Yorioka, Tomohiro Shimizu, Takeshi Ito, Shoso Shingubara
2018 — conf
Toward Automatic Tuning of Tendon-driven Mechanisms: Vibration based Detection of Tendon Tension.
ISR
Tomohiro Shimizu, Wenyang Li, Peng Chen, Yinlai Jiang, Shunta Togo, Hiroshi Yokoi
2015 — conf
All-wet TSV filling with highly adhesive displacement plated Cu seed layer.
3DIC
Kohei Ohta, Atsushi Hirate, Yuto Miyachi, Tomohiro Shimizu, Shoso Shingubara
2013 — conf
Highly conformal and adhesive electroless barrier and Cu seed formation using nanoparticle catalyst for realizing a high aspect ratio cu-filled TSV.
3DIC
S. Nishizawa, Ryohei Arima, Tomohiro Shimizu, Shoso Shingubara, Fumihiro Inoue
2011 — conf
Low temperature through-Si via fabrication using electroless deposition.
3DIC
Fumihiro Inoue, Harold Philipsen, Alex Radisic, Silvia Armini, Peter Leunissen, Hiroshi Miyake, Ryohei Arima, Tomohiro Shimizu, Toshiaki Ito, Hirofumi Seki, Yuko Shinozaki, Tomohiko Yamamoto, Shoso Shingubara
2010 — conf
All-wet fabrication technology for high aspect ratio TSV using electroless barrier and seed layers.
3DIC
Fumihiro Inoue, Takumi Yokoyama, Hiroshi Miyake, Shukichi Tanaka, Toshifumi Terui, Tomohiro Shimizu, Shoso Shingubara