| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
Math. Comput. Simul.
|
| 2026 | J | jnl |
CoRR
|
| 2026 | J | jnl |
IEEE Commun. Lett.
|
| 2026 | J | jnl |
Comput. Electron. Agric.
|
| 2025 | — | conf |
ICONIP (4)
|
| 2025 | J | jnl |
IEEE Commun. Lett.
|
| 2025 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | — | conf |
VTC2025-Fall
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2025 | J | jnl |
Comput. Electr. Eng.
|
| 2025 | J | jnl |
J. Supercomput.
|
| 2025 | — | conf |
ACL (Findings)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | — | conf |
ACL (1)
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
INFORMS J. Comput.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A* | conf |
ACM Multimedia
|
| 2025 | J | jnl |
IEEE Access
|
| 2025 | — | conf |
VTC2025-Fall
|
| 2025 | J | jnl |
Geo spatial Inf. Sci.
|
| 2025 | C | conf |
IAS
|
| 2025 | J | jnl |
Ann. GIS
|
| 2025 | J | jnl |
Ann. GIS
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Syst.
|
| 2025 | — | conf |
ACL (Findings)
|
| 2025 | — | conf |
EMNLP (System Demonstrations)
|
| 2025 | — | conf |
EMNLP (Findings)
|
| 2025 | J | jnl |
CoRR
|
| 2025 | A | conf |
WSDM
|
| 2025 | A* | conf |
ASE
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A* | conf |
ICLR
|
| 2024 | — | conf |
PEAI
|
| 2024 | — | conf |
WASA (3)
|
| 2024 | — | conf |
PEAI
|
| 2024 | J | jnl |
Multim. Tools Appl.
|
| 2024 | — | conf |
EMNLP (Findings)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ACL (Short Papers)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Dependable Secur. Comput.
|
| 2024 | A* | conf |
ICLR
|
| 2024 | — | conf |
ICSRS
|
| 2024 | J | jnl |
CoRR
|
| 2024 | J | jnl |
SIAM J. Appl. Math.
|
| 2023 | J | jnl |
Sensors
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
AIPR
|
| 2023 | J | jnl |
Int. J. Comput. Commun. Control
|
| 2023 | J | jnl |
IEEE Trans. Image Process.
|
| 2023 | A* | conf |
AAAI
|
| 2023 | J | jnl |
BMC Medical Imaging
|
| 2023 | C | conf |
SAFEPROCESS
|
| 2023 | J | jnl |
Complex Intell. Syst.
|
| 2023 | A* | conf |
EMNLP
|
| 2022 | J | jnl |
ISPRS Int. J. Geo Inf.
|
| 2022 | J | jnl |
J. Comb. Optim.
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
Sensors
|
| 2021 | — | conf |
SPAC
|
| 2021 | J | jnl |
Microelectron. J.
|
| 2021 | — | conf |
ICAIT
|
| 2021 | — | — |
|
| 2020 | J | jnl |
Int. J. Digit. Earth
|
| 2019 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Trans. Smart Grid
|
| 2018 | J | jnl |
Frontiers Inf. Technol. Electron. Eng.
|
| 2018 | — | conf |
ICVISP
|
| 2018 | C | conf |
IGARSS
|
| 2018 | — | conf |
SmartGridComm
|
| 2017 | — | conf |
ICCA
|
| 2016 | — | conf |
ICIRA (2)
|
| 2015 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2015 | A* | conf |
DAC
|
| 2015 | — | conf |
PCM (1)
|
| 2014 | J | jnl |
IEEE Trans. Cybern.
|
| 2013 | A* | conf |
ICRA
|
| 2013 | — | conf |
ROBIO
|
| 2012 | J | jnl |
Int. J. Wirel. Mob. Comput.
|