| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Open J. Comput. Soc.
|
| 2025 | J | jnl |
IEEE Internet Things J.
|
| 2025 | J | jnl |
Digit.
|
| 2025 | J | jnl |
Comput.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | J | jnl |
IEEE Access
|
| 2024 | J | jnl |
Inf.
|
| 2024 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2024 | — | conf |
COOL CHIPS
|
| 2023 | J | jnl |
Cryptogr.
|
| 2023 | — | conf |
candar
|
| 2023 | — | conf |
MWSCAS
|
| 2023 | J | jnl |
IEEE Des. Test
|
| 2023 | J | jnl |
Sensors
|
| 2023 | — | conf |
MCSoC
|
| 2023 | — | conf |
ICIT
|
| 2023 | — | conf |
SOCC
|
| 2023 | — | conf |
KSE
|
| 2023 | — | conf |
ICIT
|
| 2023 | — | conf |
RIVF
|
| 2023 | — | conf |
MCSoC
|
| 2023 | — | conf |
ICICDT
|
| 2022 | — | conf |
IPDPS Workshops
|
| 2022 | — | conf |
SBCCI
|
| 2022 | J | jnl |
IEEE Access
|
| 2022 | — | conf |
MWSCAS
|
| 2022 | — | conf |
SBCCI
|
| 2022 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2021 | — | conf |
COOL CHIPS
|
| 2021 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
IEEE ICBC
|
| 2019 | — | conf |
ICCBN
|
| 2019 | — | conf |
RIVF
|
| 2019 | J | jnl |
CoRR
|
| 2019 | C | conf |
APCC
|
| 2018 | — | conf |
GLOBECOM Workshops
|
| 2018 | J | jnl |
CoRR
|
| 2018 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2017 | J | jnl |
J. Commun.
|
| 2016 | — | conf |
COOL Chips
|
| 2016 | — | conf |
APCCAS
|
| 2016 | — | conf |
CANDAR
|
| 2014 | — | conf |
VTC Fall
|
| 2014 | C | conf |
ISCAS
|
| 2014 | — | conf |
APCCAS
|
| 2014 | — | conf |
ISCIT
|
| 2014 | J | jnl |
EURASIP J. Wirel. Commun. Netw.
|
| 2013 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2012 | C | conf |
ISCAS
|