| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2023 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | J | jnl |
Int. J. Intell. Syst.
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
Appl. Soft Comput.
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2020 | — | conf |
CISP-BMEI
|
| 2020 | J | jnl |
Sensors
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | J | jnl |
Comput. Networks
|
| 2019 | J | jnl |
Sensors
|
| 2019 | J | jnl |
IEEE Access
|
| 2019 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2019 | C | conf |
ICCE
|
| 2019 | J | jnl |
IEEE Access
|
| 2017 | J | jnl |
Int. J. Commun. Syst.
|
| 2015 | — | conf |
UIC/ATC/ScalCom
|
| 2015 | — | conf |
UIC/ATC/ScalCom
|