Takayuki Ohba - RankMe

17 papers Journal 4Unranked 13

Year	Rank	Type	Title / Venue / Authors
2026	J	`jnl`	Lattice-Matched InAlN/GaN D-Mode MIS-HEMT on SiC for High-Current Operation and Low-Loss 100-V Double-Pulse Switching. IEEE Access Shyh-Jer Huang, Tzy-Yu Shen, Yu-Chen Liu, Yung-Wei Chen, Jian-Kai Chen, Chun-Yu Lin, Zi-Hao Wang, Takashi Yoda, Takayuki Ohba, Meng-Chyi Wu, Yan-Kuin Su
2025	J	`jnl`	A Through Silicon Via (TSV) Architecture of the Bumpless Build Cube (BBCube) for Stacked Memory Devices. IEEE J. Emerg. Sel. Topics Circuits Syst. Shinji Sugatani, Hiroyuki Ryoson, Norio Chujo, Masao Taguchi, Koji Sakui, Takayuki Ohba
2025	J	`jnl`	Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WOW and COW. IEEE J. Emerg. Sel. Topics Circuits Syst. Norio Chujo, Hiroyuki Ryoson, Koji Sakui, Shinji Sugatani, Masao Taguchi, Takayuki Ohba
2024	—	`conf`	Face-Down and Heterogeneous Chip Bonding Technology on Waffle-Wafer for Bumpless Chip-an-Wafer (COW) Package. 3DIC Yoshiaki Satake, Tatsuya Funaki, Wataru Doi, Hajime Kato, Shogo Okita, Takayuki Ohba
2023	—	`conf`	Bumpless Build Cube (BBCube) 3D: Heterogeneous 3D Integration Using WoW and CoW to Provide TB/s Bandwidth with Lowest Bit Access Energy. VLSI Technology and Circuits Norio Chujo, Koji Sakui, Shinji Sugatani, Hiroyuki Ryoson, Tomoji Nakamura, Takayuki Ohba
2022	—	`conf`	Low-ESL (<1 pH @ 8.5 GHz) Multi-Terminal Si Capacitor Embedded in 3D Functional Interposer for Power Delivery Network. VLSI Technology and Circuits Kyosuke Kobinata, Tatsuya Funaki, Yoshiaki Satake, Hitoshi Matsuno, Seiji Hidaka, Shunsuke Abe, Hiroyuki Ito, Chih-Cheng Hsiao, Sheng Yi Li, Young-Suk Kim, Takayuki Ohba
2021	—	`conf`	Reliability of Wafer-Level Ultra-Thinning down to 3 µm using 20 nm-Node DRAMs. IRPS Zhwen Chen, Young-Suk Kim, Tadashi Fukuda, Koji Sakui, Takayuki Ohba, Tatsuji Kobayashi, Takashi Obara
2019	—	`conf`	High Bandwidth Memory (HBM) and High Bandwidth NAND (HBN) with the Bumpless TSV Technology. 3DIC Koji Sakui, Takayuki Ohba
2019	—	`conf`	Temperature Cycling Reliability of WOW Bumpless Through Silicon Vias. 3DIC Chia-Hsuan Lee, Hsin-Chi Chang, Jui-Han Liu, Hiroyuki Ito, Young-Suk Kim, Kuan-Neng Chen, Takayuki Ohba
2019	—	`conf`	Three-dimensional Integration (3DI) with Bumpless Interconnects for Tera-scale Generation : High Speed, Low Power, and Ultra-small Operating Platform. CICC Koji Sakui, Takayuki Ohba
2015	—	`conf`	Characterization of stress distribution in ultra-thinned DRAM wafer. 3DIC Tomoji Nakamura, Yoriko Mizushima, Young-Suk Kim, Ryuichi Sugie, Takayuki Ohba
2015	J	`jnl`	Review of wafer-level three-dimensional integration (3DI) using bumpless interconnects for tera-scale generation. IEICE Electron. Express Takayuki Ohba, Young-Suk Kim, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Shoichi Kodama
2014	—	`conf`	Impact of Thermomechanical Stresses on Ultra-thin Si Stacked Structure. 3DIC Yoriko Mizushima, Young-Suk Kim, Tomoji Nakamura, Shoichi Kodama, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba
2013	—	`conf`	Influence of wafer thinning process on backside damage in 3D integration. 3DIC Tadao Nakamura, Yoriko Mizushima, Hideki Kitada, Young-Suk Kim, Nobuhide Maeda, Shoichi Kodama, Ryuichi Sugie, Hiroshi Hashimoto, Akihito Kawai, Kazuhisa Arai, Akira Uedono, Takayuki Ohba
2011	—	`conf`	Characterization of local strain around trough silicon via interconnects in wafer-on-wafer structures. 3DIC Osamu Nakatsuka, Hideki Kitada, Young-Suk Kim, Yoriko Mizushima, Tomoji Nakamura, Takayuki Ohba, Shigeaki Zaima
2011	—	`conf`	Comparative study of side-wall roughness effects on leakage currents in through-silicon via interconnects. 3DIC Tomoji Nakamura, Hideki Kitada, Yoriko Mizushima, Nobuhide Maeda, Koji Fujimoto, Takayuki Ohba
2011	—	`conf`	Development of ultra-thinning technology for logic and memory heterogeneous stack applications. 3DIC Nobuhide Maeda, Young-Suk Kim, Y. Hikosaka, Takashi Eshita, Hideki Kitada, K. Fujimoto, Yoriko Mizushima, K. Suzuki, Tadao Nakamura, Akihito Kawai, Kazuhisa Arai, Takayuki Ohba