| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
J. Ambient Intell. Humaniz. Comput.
|
| 2025 | — | conf |
MIUA (3)
|
| 2024 | C | conf |
ISM
|
| 2024 | Misc | conf |
VTS
|
| 2024 | J | jnl |
Int. J. Semantic Comput.
|
| 2023 | — | conf |
VLSI Technology and Circuits
|
| 2023 | — | conf |
TransAI
|
| 2023 | Misc | conf |
SEC
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2021 | J | jnl |
IEEE J. Solid State Circuits
|
| 2021 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2021 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2021 | — | conf |
ISSCC
|
| 2021 | J | jnl |
IEICE Trans. Electron.
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2020 | — | conf |
ISSCC
|
| 2020 | — | conf |
VLSI Circuits
|
| 2020 | J | jnl |
IEEE J. Solid State Circuits
|
| 2020 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2019 | — | conf |
ISSCC
|
| 2019 | Misc | conf |
FCCM
|
| 2019 | — | conf |
GC
|
| 2018 | — | conf |
IEEE SENSORS
|
| 2018 | — | conf |
COOL CHIPS
|
| 2017 | — | conf |
ESSCIRC
|
| 2016 | — | conf |
IEEE SENSORS
|
| 2016 | — | conf |
IEEE SENSORS
|
| 2015 | C | conf |
ISCAS
|
| 2015 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2014 | C | conf |
ISCAS
|
| 2014 | J | jnl |
IEEE J. Solid State Circuits
|
| 2014 | J | jnl |
BMC Medical Imaging
|
| 2010 | J | jnl |
IEICE Trans. Electron.
|
| 2009 | C | conf |
ISCAS
|
| 2007 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2006 | J | jnl |
IEICE Trans. Electron.
|
| 2005 | J | jnl |
IEICE Trans. Electron.
|
| 2005 | — | conf |
ISCAS (4)
|
| 2004 | J | jnl |
IEEE J. Solid State Circuits
|
| 2004 | J | jnl |
IEEE J. Solid State Circuits
|
| 2003 | — | conf |
CICC
|