| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
IEEE Des. Test
|
| 2025 | J | jnl |
Proc. ACM Interact. Mob. Wearable Ubiquitous Technol.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2024 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2024 | — | conf |
IPSN
|
| 2023 | J | jnl |
IEEE Trans. Netw. Serv. Manag.
|
| 2023 | J | jnl |
IEEE Internet Things J.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | — | conf |
ISQED
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | Misc | conf |
ICASSP
|
| 2022 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2022 | J | jnl |
Store-n-Learn: Classification and Clustering with Hyperdimensional Computing across Flash Hierarchy.
ACM Trans. Embed. Comput. Syst.
|
| 2021 | Misc | conf |
SenSys
|
| 2021 | B | conf |
CNSM
|
| 2021 | A* | conf |
DAC
|
| 2021 | A | conf |
ICCAD
|
| 2021 | A | conf |
DATE
|
| 2020 | A* | conf |
DAC
|
| 2020 | J | jnl |
IACR Cryptol. ePrint Arch.
|
| 2020 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2020 | A | conf |
ISLPED
|
| 2020 | — | conf |
SmartGridComm
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | — | conf |
IEEE SENSORS
|
| 2020 | B | conf |
CNSM
|
| 2020 | — | conf |
FPT
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | A | conf |
ICCAD
|
| 2020 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Des. Test
|
| 2019 | — | ch. |
Approximate Circuits
|
| 2019 | A | conf |
ISLPED
|
| 2019 | — | conf |
ICNSC
|
| 2019 | J | jnl |
IEEE Micro
|
| 2019 | J | jnl |
IEEE Trans. Computers
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
CoRR
|
| 2019 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2019 | A | conf |
DATE
|
| 2018 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2018 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2018 | — | conf |
IOT
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | J | jnl |
IEEE Internet Things J.
|
| 2018 | J | jnl |
IEEE Trans. Multi Scale Comput. Syst.
|
| 2018 | J | jnl |
IEEE Trans. Mob. Comput.
|
| 2017 | — | conf |
PerCom Workshops
|
| 2017 | — | conf |
PerCom Workshops
|
| 2017 | — | conf |
CCWC
|
| 2017 | A* | conf |
DAC
|
| 2017 | J | jnl |
IEEE Softw.
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | — | conf |
IoTDI
|
| 2016 | — | conf |
SENSORNETS
|
| 2016 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2016 | — | conf |
ISQED
|
| 2016 | A | conf |
DATE
|
| 2016 | — | conf |
EuCNC
|
| 2016 | — | ch. |
Computational Sustainability
|
| 2016 | A | conf |
DATE
|
| 2016 | — | conf |
SmartGridComm
|
| 2016 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2015 | A | conf |
ICCAD
|
| 2015 | — | conf |
MobiCASE
|
| 2015 | — | conf |
ANCS
|
| 2015 | B | conf |
GLOBECOM
|
| 2015 | — | conf |
NANOARCH
|
| 2015 | A | conf |
ICCAD
|
| 2015 | J | jnl |
it Inf. Technol.
|
| 2015 | — | conf |
IGSC
|
| 2015 | A | conf |
ICCAD
|
| 2015 | B | conf |
GLOBECOM
|
| 2014 | A | conf |
DATE
|
| 2014 | A | conf |
Ambient variation-tolerant and inter components aware thermal management for mobile system on chips.
DATE
|
| 2014 | C | conf |
EUC
|
| 2014 | — | conf |
BuildSys
|
| 2014 | C | conf |
ICCD
|
| 2014 | — | conf |
ISSNIP
|
| 2014 | — | conf |
SmartGridComm
|
| 2014 | J | jnl |
IEEE Des. Test
|
| 2014 | — | conf |
MobiCASE
|
| 2013 | B | conf |
GLOBECOM
|
| 2013 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2013 | J | jnl |
SIGMETRICS Perform. Evaluation Rev.
|
| 2013 | — | conf |
SmartGridComm
|
| 2013 | A | conf |
MSWiM
|
| 2013 | J | jnl |
J. Low Power Electron.
|
| 2013 | — | conf |
IGCC
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | C | conf |
ISCC
|
| 2013 | C | conf |
ISCC
|
| 2013 | A* | conf |
DAC
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | A* | conf |
DAC
|
| 2013 | — | conf |
IPDPS Workshops
|
| 2012 | A | conf |
DATE
|
| 2012 | — | conf |
Wireless Health
|
| 2012 | A | conf |
ISLPED
|
| 2012 | A | conf |
DATE
|
| 2012 | A* | conf |
ISCA
|
| 2012 | — | conf |
ICC
|
| 2012 | A | conf |
DATE
|
| 2012 | — | conf |
Euro-Par Workshops
|
| 2012 | J | jnl |
Computer
|
| 2011 | A | conf |
ISLPED
|
| 2011 | C | conf |
ICCD
|
| 2011 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2011 | J | jnl |
J. Low Power Electron.
|
| 2011 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2011 | B | conf |
ICCCN
|
| 2010 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2010 | — | conf |
ASP-DAC
|
| 2010 | A | conf |
DATE
|
| 2010 | A | conf |
ISLPED
|
| 2010 | A | conf |
DATE
|
| 2010 | A | conf |
DATE
|
| 2010 | — | conf |
ASP-DAC
|
| 2010 | C | conf |
ICCD
|
| 2009 | A | conf |
DATE
|
| 2009 | — | conf |
SIGMETRICS/Performance
|
| 2009 | — | conf |
IPSN
|
| 2009 | A | conf |
ISLPED
|
| 2009 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2009 | C | conf |
DSD
|
| 2009 | C | conf |
VLSI-SoC
|
| 2009 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2008 | — | conf |
ISQED
|
| 2008 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2008 | A | conf |
ICCAD
|
| 2008 | A | conf |
ISLPED
|
| 2008 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2008 | A* | conf |
DAC
|
| 2008 | — | conf |
ASP-DAC
|
| 2007 | — | conf |
IPSN
|
| 2007 | A | conf |
ISLPED
|
| 2007 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2007 | — | ch. |
Handbook of Real-Time and Embedded Systems
|
| 2007 | A | conf |
DATE
|
| 2006 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2006 | A | conf |
ICCAD
|
| 2006 | C | conf |
ISM
|
| 2004 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2003 | — | conf |
PACS
|