Tadatomo Suga

15 papers A 2Journal 12Unranked 1
YearRankTypeTitle / Venue / Authors
2023 J jnl
Defect evolution in GaN thin film heterogeneously integrated with CMOS-compatible Si(100) substrate by ion-cutting technology.
Sci. China Inf. Sci.
Hangning Shi, Ailun Yi, Jiaxin Ding, Xudong Liu, Qingcheng Qin, Juemin Yi, Junjie Hu, Miao Wang, Demin Cai, Jianfeng Wang, Ke Xu, Fengwen Mu, Tadatomo Suga, René Heller, Mao Wang, Shengqiang Zhou, Wenhui Xu, Kai Huang, Tiangui You, Xin Ou
2019 J jnl
Growth Behavior of Au Films on SiO
Int. J. Autom. Technol.
Michitaka Yamamoto, Takashi Matsumae, Yuichi Kurashima, Hideki Takagi, Tadatomo Suga, Toshihiro Itoh, Eiji Higurashi
2017 J jnl
Room-Temperature Bonding of Wafers with Smooth Au Thin Films in Ambient Air Using a Surface-Activated Bonding Method.
IEICE Trans. Electron.
Eiji Higurashi, Ken Okumura, Yutaka Kunimune, Tadatomo Suga, Kei Hagiwara
2016 J jnl
Room-Temperature Gold-Gold Bonding Method Based on Argon and Hydrogen Gas Mixture Atmospheric-Pressure Plasma Treatment for Optoelectronic Device Integration.
IEICE Trans. Electron.
Eiji Higurashi, Michitaka Yamamoto, Takeshi Sato, Tadatomo Suga, Renshi Sawada
2015 J jnl
Fast atom bombardment onto vertically aligned multi-walled carbon nanotube bumps to achieve low interconnect resistance with Au layer.
Microelectron. Reliab.
Masahisa Fujino, Ikuo Soga, Daiyu Kondo, Yoshikatsu Ishizuki, Taisuke Iwai, Tadatomo Suga
2012 J jnl
Guest Editorial - Low Temperature Processing for Microelectronics and Microsystems Packaging.
Microelectron. Reliab.
Tadatomo Suga, Jenn-Ming Song, Yi-Shao Lai
2012 J jnl
Investigation of fluorine containing plasma activation for room-temperature bonding of Si-based materials.
Microelectron. Reliab.
Chenxi Wang, Tadatomo Suga
2012 J jnl
Nanoadhesion layer for enhanced Si-Si and Si-SiN wafer bonding.
Microelectron. Reliab.
Ryuichi Kondou, Chenxi Wang, Akitsu Shigetou, Tadatomo Suga
2011 — conf
Low temperature bonding for 3D interconnects.
3DIC
Tadatomo Suga, Ryuichi Kondoh
2009 J jnl
Optical Microsensors Integration Technologies for Biomedical Applications.
IEICE Trans. Electron.
Eiji Higurashi, Renshi Sawada, Tadatomo Suga
2009 J jnl
Residue-Free Solder Bumping Using Small AuSn Particles by Hydrogen Radicals.
IEICE Trans. Electron.
Eiji Higurashi, Daisuke Chino, Tadatomo Suga
2007 J jnl
Low-Temperature Au-to-Au Bonding for LiNbO
IEICE Trans. Electron.
Ryo Takigawa, Eiji Higurashi, Tadatomo Suga, Satoshi Shinada, Tetsuya Kawanishi
2003 A conf
Low Contact-Force Fritting Probe Card Using Buckling Microcantilevers.
ITC
Kenichi Kataoka, Toshihiro Itoh, Tadatomo Suga
2003 J jnl
Reliability of Au bump-Cu direct interconnections fabricated by means of surface activated bonding method.
Microelectron. Reliab.
Qian Wang, Naoe Hosoda, Toshihiro Itoh, Tadatomo Suga
2002 A conf
Low-Contact-Force Probing on Copper Electrodes.
ITC
Kenichi Kataoka, Toshihiro Itoh, Katsuya Okumura, Tadatomo Suga