Sébastien Thuries

30 papers A 4B 1C 2Journal 4Unranked 19

Year	Rank	Type	Title / Venue / Authors
2025	A	`conf`	J3DAI: A tiny DNN-Based Edge AI Accelerator for 3D-Stacked CMOS Image Sensor. ISLPED Benoît Tain, Raphael Millet, Romain Lemaire, Michal Szczepanski, Laurent Alacoque, Emmanuel Pluchart, Sylvain Choisnet, Rohit Prasad, Jérôme Chossat, Pascal Pierunek, Pascal Vivet, Sébastien Thuries
2025	J	`jnl`	J3DAI: A tiny DNN-Based Edge AI Accelerator for 3D-Stacked CMOS Image Sensor. CoRR Benoît Tain, Raphael Millet, Romain Lemaire, Michal Szczepanski, Laurent Alacoque, Emmanuel Pluchart, Sylvain Choisnet, Rohit Prasad, Jérôme Chossat, Pascal Pierunek, Pascal Vivet, Sébastien Thuries
2024	—	`conf`	A 450µW@50fps Wake-Up Module Featuring Auto-Bracketed 3-Scale Log-Corrected Pattern Recognition and Motion Detection in a 1.5Mpix 8T Global Shutter Imager. VLSI Technology and Circuits Arnaud Verdant, William Guicquero, David Coriat, Guillaume Moritz, Nicolas Royer, Sébastien Thuries, Anais Mollard, Vincent Teil, Yann Desprez, Gilles Monnot, Pierre Malinge, Bruno Paille, Guillaume Caubit, Arnaud Bourge, Laurent Tardif, Stephanie Bigault, Jérôme Chossat
2022	J	`jnl`	Introduction to the Special Issue on Monolithic 3D: Technology, Design and Computing Systems Applications Perspectives. ACM J. Emerg. Technol. Comput. Syst. Sébastien Thuries, Aida Todri-Sanial
2021	J	`jnl`	IntAct: A 96-Core Processor With Six Chiplets 3D-Stacked on an Active Interposer With Distributed Interconnects and Integrated Power Management. IEEE J. Solid State Circuits Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, César Fuguet Tortolero, Ivan Miro-Panades, Guillaume Moritz, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
2020	—	`conf`	2.3 A 220GOPS 96-Core Processor with 6 Chiplets 3D-Stacked on an Active Interposer Offering 0.6ns/mm Latency, 3Tb/s/mm ISSCC Pascal Vivet, Eric Guthmuller, Yvain Thonnart, Gaël Pillonnet, Guillaume Moritz, Ivan Miro-Panades, César Fuguet Tortolero, Jean Durupt, Christian Bernard, Didier Varreau, Julian J. H. Pontes, Sébastien Thuries, David Coriat, Michel Harrand, Denis Dutoit, Didier Lattard, Lucile Arnaud, Jean Charbonnier, Perceval Coudrain, Arnaud Garnier, Frédéric Berger, Alain Gueugnot, Alain Greiner, Quentin L. Meunier, Alexis Farcy, Alexandre Arriordaz, Séverine Cheramy, Fabien Clermidy
2020	A	`conf`	M3D-ADTCO: Monolithic 3D Architecture, Design and Technology Co-Optimization for High Energy Efficient 3D IC. DATE Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Romain Lemaire, Pascal Vivet, Perrine Batude, Didier Lattard
2019	A	`conf`	Advanced 3D Technologies and Architectures for 3D Smart Image Sensors. DATE Pascal Vivet, Gilles Sicard, Laurent Millet, Stéphane Chevobbe, Karim Ben Chehida, Luis Angel Cubero, Monte Alegre, Maxence Bouvier, Alexandre Valentian, Maria Lepecq, Thomas Dombek, Olivier Bichler, Sébastien Thuries, Didier Lattard, Séverine Cheramy, Perrine Batude, Fabien Clermidy
2019	—	`conf`	Merging PDKs to Build a Design Environment for 3D Circuits: Methodology, Challenges and Limitations. 3DIC Olivier Billoint, Karim Azizi-Mourier, Gerald Cibrario, Didier Lattard, Mehdi Mouhdach, Sébastien Thuries, Pascal Vivet
2019	B	`conf`	Test Solutions for High Density 3D-IC Interconnects - Focus on SRAM-on-Logic Partitioning. ETS Imed Jani, Didier Lattard, Pascal Vivet, Jean Durupt, Sébastien Thuries, Edith Beigné
2018	—	`conf`	A review on opportunities brought by 3D-monolithic integration for CMOS device and digital circuit. ICICDT François Andrieu, Perrine Batude, Laurent Brunet, Claire Fenouillet-Béranger, Didier Lattard, Sébastien Thuries, Olivier Billoint, Richard Fournel, Maud Vinet
2018	—	`conf`	Monolithic 3D: an alternative to advanced CMOS scaling, technology perspectives and associated design methodology challenges. ICECS Pascal Vivet, Sébastien Thuries, Olivier Billoint, Sylvain Choisnet, Didier Lattard, Edith Beigné, Perrine Batude
2018	C	`conf`	Some Local Stability Properties of an Autonomous Long Short-Term Memory Neural Network Model. ISCAS Dusan M. Stipanovic, Boris Murmann, Matteo Causo, Aleksandra Lekic, Vicenc Rubies-Royo, Claire J. Tomlin, Edith Beigné, Sébastien Thuries, Mykhailo Zarudniev, Suzanne Lesecq
2017	—	`conf`	7.5 A TCXO-less 100Hz-minimum-bandwidth transceiver for ultra-narrow-band sub-GHz IoT cellular networks. ISSCC David Lachartre, Francois Dehmas, Carolynn Bernier, Christophe Fourtet, Laurent Ouvry, Florent Lepin, Eric Mercier, Steve Hamard, Lionel Zirphile, Sébastien Thuries, Fabrice Chaix
2017	J	`jnl`	Cell-on-Buffer: New design approach for high-performance and low-power monolithic 3D integrated circuits. Microelectron. J. Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy
2017	—	`conf`	Transistor Temperature Deviation Analysis in Monolithic 3D Standard Cells. ISVLSI Melanie Brocard, Benoît Mathieu, Jean-Philippe Colonna, Cristiano Santos, Claire Fenouillet-Béranger, Cao-Minh Vincent Lu, Gerald Cibrario, Laurent Brunet, Perrine Batude, François Andrieu, Sébastien Thuries, Olivier Billoint
2016	—	`conf`	3DIP: An iterative partitioning tool for monolithic 3D IC. 3DIC Guillaume Berhault, Melanie Brocard, Sébastien Thuries, François Galea, Lilia Zaourar
2016	—	`conf`	DRC ICRC Kaya Can Akyel, Henri-Pierre Charles, Julien Mottin, Bastien Giraud, Gregory Suraci, Sébastien Thuries, Jean-Philippe Noel
2016	—	`conf`	From 2D to monolithic 3D predictive design platform: An innovative migration methodology for benchmark purpose. 3DIC Gerald Cibrario, Nour Ben Salem, Joris Lacord, Karim Azizi-Mourier, Olivier Rozeau, Etienne Maurin, Olivier Billoint, Sébastien Thuries, Alexandre Valentian
2016	—	`conf`	Impact of intermediate BEOL technology on standard cell performances of 3D VLSI. ESSDERC Melanie Brocard, Guillaume Berhault, Sébastien Thuries, Fabien Clermidy, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, François Andrieu, Fabien Deprat, Joris Lacord, Olivier Rozeau, Gerald Cibrario, Olivier Billoint
2016	—	`conf`	Opportunities brought by sequential 3D CoolCube™ integration. ESSDERC Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Guillaume Berhault, Cristiano Lopes Dos Santos, Gerald Cibrario, Fabien Clermidy, Daniel Gitlin, Olivier Faynot
2016	—	`conf`	Recent advances in 3D VLSI integration. ICICDT Claire Fenouillet-Béranger, Perrine Batude, Laurent Brunet, Vincent Mazzocchi, Cao-Minh Vincent Lu, Fabien Deprat, Jessy Micout, M.-P. Samson, Bernard Previtali, Paul Besombes, Nils Rambal, François Andrieu, Olivier Billoint, Melanie Brocard, Sébastien Thuries, Gerald Cibrario, Maud Vinet
2016	—	`conf`	Thermal performance of CoolCube™ monolithic and TSV-based 3D integration processes. 3DIC Cristiano Santos, Pascal Vivet, Sébastien Thuries, Olivier Billoint, Jean-Philippe Colonna, Perceval Coudrain, Lee Wang
2015	A	`conf`	A comprehensive study of monolithic 3D cell on cell design using commercial 2D tool. DATE Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, A. Fustier, Julien Michallet, Olivier Faynot, Ogun Turkyilmaz, Jean-Frédéric Christmann, Sébastien Thuries, Fabien Clermidy
2015	—	`conf`	An Unbalanced Area Ratio Study for High Performance Monolithic 3D Integrated Circuits. ISVLSI Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy
2015	C	`conf`	Compact interconnect approach for networks of neural cliques using 3D technology. VLSI-SoC Bartosz Boguslawski, Hossam Sarhan, Frédéric Heitzmann, Fabrice Seguin, Sébastien Thuries, Olivier Billoint, Fabien Clermidy
2015	—	`conf`	From 2D to Monolithic 3D: Design Possibilities, Expectations and Challenges. ISPD Olivier Billoint, Hossam Sarhan, Iyad Rayane, Maud Vinet, Perrine Batude, Claire Fenouillet-Béranger, Olivier Rozeau, Gerald Cibrario, Fabien Deprat, Ogun Turkyilmaz, Sébastien Thuries, Fabien Clermidy
2015	—	`conf`	Intermediate BEOL process influence on power and performance for 3DVLSI. 3DIC Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Deprat, Alexandre Ayres De Sousa, Perrine Batude, Claire Fenouillet-Béranger, Fabien Clermidy
2014	—	`conf`	3DCoB: A new design approach for Monolithic 3D Integrated circuits. ASP-DAC Hossam Sarhan, Sébastien Thuries, Olivier Billoint, Fabien Clermidy
2012	—	`conf`	A flexible modeling environment for a NoC-based multicore architecture. HLDVT Romain Lemaire, Sébastien Thuries, Frédéric Heitzmann