Sven Rzepka

12 papers C 1Journal 10Unranked 1
YearRankTypeTitle / Venue / Authors
2023 — conf
A Data-driven Condition Monitoring method to predict the Remaining Useful Life of SiC Power Modules for Traction Inverters.
ICPHM
Giovanni Di Nuzzo, Horst Lewitschnig, Marc Tüllmann, Sven Rzepka, Alexander Otto
2021 C conf
The H2020-ECSEL Project "iRel40" (Intelligent Reliability 4.0).
DSD
Klaus Pressel, Josef Moser, Sven Rzepka, Klas Brinkfeldt, Susan Zhao, Willem D. van Driel, Paolo Giammatteo, Baris Bulut, Müjdat Soytürk, Luigi Pomante
2018 J jnl
Combined simulation and optical measurement technique for investigation of system effects on components solder fatigue.
Microelectron. Reliab.
Rainer Dudek, M. Hildebrand, Sven Rzepka, T. Fries, Ralf Döring, Bettina Seiler, R. W. Ortmann
2018 J jnl
Investigations of the impact of initial stresses on fracture and delamination risks of an avionics MEMS pressure sensor.
Microelectron. Reliab.
Jürgen Auersperg, Ellen Auerswald, Christian Collet, Thierry Dean, Dietmar Vogel, Thomas Winkler, Sven Rzepka
2018 J jnl
Reliability testing of integrated low-temperature PVD PZT films.
Microelectron. Reliab.
Daniel Monteiro Diniz Reis, Sven Rzepka, Karla Hiller
2016 J jnl
An in-situ numerical-experimental approach for fatigue delamination characterization in microelectronic packages.
Microelectron. Reliab.
Emad A. Poshtan, Sven Rzepka, Christian Silber, Bernhard Wunderle
2016 J jnl
Fast and trusted intrinsic stress measurement to facilitate improved reliability assessments.
Microelectron. Reliab.
Dietmar Vogel, Ellen Auerswald, Gh. Gadhiya, Sven Rzepka
2014 J jnl
On the crack and delamination risk optimization of a Si-interposer for LED packaging.
Microelectron. Reliab.
Jürgen Auersperg, Rainer Dudek, R. Jordan, O. Bochow-Neß, Sven Rzepka, Bernd Michel
2014 J jnl
Stress analyses of high spatial resolution on TSV and BEoL structures.
Microelectron. Reliab.
Dietmar Vogel, Ellen Auerswald, Jürgen Auersperg, Parisa Bayat, Raul D. Rodriguez, Dietrich R. T. Zahn, Sven Rzepka, Bernd Michel
2014 J jnl
Stress impact of moisture diffusion measured with the stress chip.
Microelectron. Reliab.
Florian Schindler-Saefkow, Florian Rost, Alexander Otto, R. Pantou, Raul Mroßko, Bernhard Wunderle, Bernd Michel, Sven Rzepka, Jürgen Keller
2013 J jnl
Effect of moisture swelling on MEMS packaging and integrated sensors.
Microelectron. Reliab.
J. Keller, Raul Mrossko, H. Dobrinski, J. Stürmann, Ralf Döring, Rainer Dudek, Sven Rzepka, Bernd Michel
2004 J jnl
Time-independent elastic-plastic behaviour of solder materials.
Microelectron. Reliab.
Steffen Wiese, Sven Rzepka