| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | — | conf |
ASP-DAC
|
| 2026 | Misc | conf |
VLSID
|
| 2026 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2026 | J | jnl |
ACM Trans. Intell. Syst. Technol.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | C | conf |
IoTBDS
|
| 2025 | J | jnl |
Appl. Intell.
|
| 2024 | Misc | conf |
VLSID
|
| 2024 | — | conf |
ICCAI
|
| 2024 | — | conf |
ICT-DM
|
| 2024 | C | conf |
IoTBDS
|
| 2024 | — | conf |
Random Microfluidic Chip Design with Diagonal Channels Using K-Means Clustering for Fluid Dilutions.
ISVLSI
|
| 2024 | Misc | conf |
VLSID
|
| 2023 | — | conf |
APCCAS
|
| 2023 | — | conf |
ICT-DM
|
| 2023 | — | conf |
LOD (1)
|
| 2023 | — | conf |
ICANN (8)
|
| 2023 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | — | conf |
ACM Great Lakes Symposium on VLSI
|
| 2023 | Misc | conf |
VLSID
|
| 2022 | J | jnl |
IEEE ACM Trans. Comput. Biol. Bioinform.
|
| 2022 | C | conf |
DSD
|
| 2022 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2022 | J | jnl |
IEEE Access
|
| 2021 | J | jnl |
J. Supercomput.
|
| 2021 | C | conf |
DSD
|
| 2021 | J | jnl |
J. Supercomput.
|
| 2021 | J | jnl |
Integr.
|
| 2021 | Misc | conf |
VLSID
|
| 2021 | J | jnl |
J. Inf. Secur. Appl.
|
| 2020 | C | conf |
IGARSS
|
| 2020 | C | conf |
IGARSS
|
| 2020 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | — | conf |
ASP-DAC
|
| 2020 | A | conf |
DATE
|
| 2019 | B | conf |
SMC
|
| 2019 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2019 | — | conf |
ASP-DAC
|
| 2019 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2019 | J | jnl |
Integr.
|
| 2019 | B | conf |
SMC
|
| 2018 | — | conf |
ICT-DM
|
| 2018 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2018 | — | conf |
ICANN (3)
|
| 2018 | C | conf |
DSD
|
| 2018 | J | jnl |
J. Low Power Electron.
|
| 2018 | — | conf |
ICANN (1)
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | A | conf |
DATE
|
| 2017 | — | conf |
ICT-DM
|
| 2017 | — | conf |
ASP-DAC
|
| 2017 | A | conf |
DATE
|
| 2016 | C | conf |
ICCD
|
| 2016 | Misc | conf |
VLSID
|
| 2016 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | J | jnl |
Integr.
|
| 2014 | — | conf |
ICAA
|
| 2014 | J | jnl |
J. Low Power Electron.
|
| 2014 | A* | conf |
DAC
|
| 2014 | J | jnl |
IET Comput. Digit. Tech.
|
| 2014 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2014 | — | conf |
ISIC
|
| 2014 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2013 | C | conf |
DDECS
|
| 2013 | — | book |
Impact of Leakage Power Reduction Techniques on Parametric Yield - Low-Power Design of Digital Integrated Circuits under Process Parameter Variations.
|
| 2013 | — | conf |
VDAT
|
| 2013 | — | conf |
ISED
|
| 2013 | — | conf |
ISVLSI
|
| 2012 | — | conf |
ISVLSI
|
| 2012 | J | jnl |
ACM J. Emerg. Technol. Comput. Syst.
|
| 2012 | — | conf |
ISED
|
| 2012 | — | conf |
ISVLSI
|
| 2011 | Misc | conf |
VLSI Design
|
| 2011 | A | conf |
DATE
|
| 2010 | J | jnl |
J. Low Power Electron.
|
| 2010 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2008 | — | conf |
ICON
|
| 2008 | C | conf |
DSD
|