Stéphane Moreau

25 papers Journal 9Unranked 16
YearRankTypeTitle / Venue / Authors
2025 J jnl
Do you understand epistemic uncertainty? Think again! Rigorous frequentist epistemic uncertainty estimation in regression.
CoRR
Enrico Foglia, Benjamin Bobbia, Nikita Durasov, Michael Bauerheim, Pascal Fua, Stéphane Moreau, Thierry Jardin
2025 — conf
Electromigration Assessment in Power Grids with Account of Non-Uniform Temperature Distribution.
IRPS
Armen Kteyan, J. Choy, Valeriy Sukharev, Stéphane Moreau, Y. Yi, R. Bloom, C. Kim
2025 — conf
Numerical and Thermal Analysis of Reverse Leakage Current of Pseudo-Vertical GaN p-n Diodes Grown with Selective Area Growth.
IRPS
Mohammed El Amrani, Thomas Kaltsounis, David Plaza Arguello, Stéphane Moreau, Hala El Rammouz, Matthew Charles, Julien Buckley, Daniel Alquier
2024 — conf
Electromigration Test Chip Experiments from Realistic Power Grid Structures: Failure Trend Comparison and Statistical Analysis.
IRPS
Yong Hyeon Yi, Chris H. Kim, Armen Kteyan, Alexander Volkov, Stéphane Moreau, Valeriy Sukharev
2024 — conf
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects.
ISPD
Jun-Ho Choy, Stéphane Moreau, Catherine Brunet-Manquat, Valeriy Sukharev, Armen Kteyan
2023 — conf
Electromigration Assessment in Power Grids with Account of Redundancy and Non-Uniform Temperature Distribution.
ISPD
Armen Kteyan, Valeriy Sukharev, Alexander Volkov, Jun-Ho Choy, Farid N. Najm, Yong Hyeon Yi, Chris H. Kim, Stéphane Moreau
2023 — conf
Recent Advances on Electromigration in Cu/SiO2 to Cu/SiO2 Hybrid Bonds for 3D Integrated Circuits.
IRPS
Stéphane Moreau, David Bouchu, J. Jourdon, Bassel Ayoub, S. Lhostis, Hélène Frémont, P. Lamontagne
2022 — conf
New Method to Perform TDDB Tests for Hybrid Bonding Interconnects.
IRPS
Bassel Ayoub, Stéphane Moreau, S. Lhostis, P. Lamontagne, H. Combeau, J. G. Mattei, Hélène Frémont
2021 — conf
3D interconnection using copper direct hybrid bonding for GaN on silicon wafer.
3DIC
Christophe Dubarry, Lucile Arnaud, Maria-Luisa Calvo-Muñoz, Gaëlle Mauguen, Stéphane Moreau, R. Crochemore, Nicolas Bresson, Bernard Aventurier
2021 — conf
Effects of Boundary Conditions in Fully Convolutional Networks for Learning Spatio-Temporal Dynamics.
ECML/PKDD (5)
Antonio Alguacil, Wagner Gonçalves Pinto, Michael Bauerheim, Marc C. Jacob, Stéphane Moreau
2021 J jnl
Effects of boundary conditions in fully convolutional networks for learning spatio-temporal dynamics.
CoRR
Antonio Alguacil, Wagner Gonçalves Pinto, Michael Bauerheim, Marc C. Jacob, Stéphane Moreau
2018 — conf
Fine pitch 3D interconnections with hybrid bonding technology: From process robustness to reliability.
IRPS
Lucile Arnaud, Stéphane Moreau, Amadine Jouve, Imed Jani, Didier Lattard, Frank Fournel, C. Euvrard, Y. Exbrayat, Viorel Balan, Nicolas Bresson, S. Lhostis, J. Jourdon, E. Deloffre, S. Guillaumet, Alexis Farcy, Simon Gousseau, M. Arnoux
2018 J jnl
Numerical analysis of a high-order unstructured overset grid method for compressible LES of turbomachinery.
J. Comput. Phys.
Jerome de Laborderie, Florent Duchaine, Laurent Gicquel, Olivier Vermorel, Gaofeng Wang, Stéphane Moreau
2016 — conf
ITAC: A complete 3D integration test platform.
3DIC
Didier Lattard, Lucile Arnaud, Arnaud Garnier, Nicolas Bresson, Franck Bana, R. Segaud, Amadine Jouve, H. Jacquinot, Stéphane Moreau, Karim Azizi-Mourier, C. Chantre, Pascal Vivet, Gaël Pillonnet, F. Casset, F. Ponthenier, Alexis Farcy, S. Lhostis, Jean Michailos, Alexandre Arriordaz, Séverine Cheramy
2015 J jnl
Electromigration-induced failure in operando characterization of 3D interconnects: microstructure influence.
Microelectron. Reliab.
Simon Gousseau, Stéphane Moreau, David Bouchu, Alexis Farcy, Pierre Montmitonnet, Karim Inal, François Bay, Marc Zelsmann, Emmanuel Picard, Mathieu Salaün
2015 J jnl
Spectral recycling strategies for the solution of nonlinear eigenproblems in thermoacoustics.
Numer. Linear Algebra Appl.
Pablo Salas, Luc Giraud, Yousef Saad, Stéphane Moreau
2014 — conf
Advances toward reliable high density Cu-Cu interconnects by Cu-SiO
3DIC
Yann Beilliard, Stéphane Moreau, Léa Di Cioccio, Perceval Coudrain, G. Romano, A. Nowodzinski, F. Aussenac, P.-H. Jouneau, E. Rolland, Thomas Signamarcheix
2014 J jnl
An overset grid method for large eddy simulation of turbomachinery stages.
J. Comput. Phys.
Gaofeng Wang, Florent Duchaine, Dimitrios Papadogiannis, Ignacio Duran, Stéphane Moreau, Laurent Y. M. Gicquel
2013 — conf
A new experimental methodology using point deflection to quantify residual stress of thin polymer membrane materials in MEMS devices.
NEMS
Sofiane Soulimane, Arnaud Pouydebasque, Sébastien Bolis, Fabrice Jacquet, Claudine Bridoux, Florian Dupont, Christophe Poulain, Stéphane Moreau, Stephane Fanget
2013 — conf
Chip to wafer copper direct bonding electrical characterization and thermal cycling.
3DIC
Yann Beilliard, Perceval Coudrain, Léa Di Cioccio, Stéphane Moreau, Loic Sanchez, Brigitte Montmayeul, Thomas Signamarcheix, Rafael Estevez, Guillaume Parry
2013 J jnl
Reliability of TSV interconnects: Electromigration, thermal cycling, and impact on above metal level dielectric.
Microelectron. Reliab.
Thomas Frank, Stéphane Moreau, Cédrick Chappaz, Patrick Leduc, Lucile Arnaud, Aurélie Thuaire, Emmanuel Chery, F. Lorut, Lorena Anghel, Gilles Poupon
2011 — conf
200°C direct bonding copper interconnects : Electrical results and reliability.
3DIC
Léa Di Cioccio, Rachid Taibi, Cédrick Chappaz, Stéphane Moreau, Laurent-Luc Chapelon, Thomas Signamarcheix
2005 — conf
MetaSurv: Web-Platform Generator for the Monitoring of Health Indicators and Interactive Geographical Information System.
MIE
Laurent Toubiana, Stéphane Moreau, Gaétan Bonnard
2004 J jnl
Comparative study of thermal cycling and thermal shocks tests on electronic components reliability.
Microelectron. Reliab.
Stéphane Moreau, Thierry Lequeu, Robert Jérisian
2002 J jnl
Influence of the turn-on mechanism on TRIACs' reliability: di/dt thermal fatigue study in Q1 compared to Q2.
Microelectron. Reliab.
Stéphane Moreau, Stéphane Forster, Thierry Lequeu, Robert Jérisian