Steve Lipa

13 papers A* 1C 3Journal 2Unranked 7
YearRankTypeTitle / Venue / Authors
2022 J jnl
Design Obfuscation Through 3-D Split Fabrication With Smart Partitioning.
IEEE Trans. Very Large Scale Integr. Syst.
Theodros Nigussie, Joshua Schabel, Steve Lipa, Lisa G. McIlrath, Robert Patti, Paul D. Franzon
2017 C conf
H3 (Heterogeneity in 3D): A Logic-on-Logic 3D-Stacked Heterogeneous Multi-Core Processor.
ICCD
Vinesh Srinivasan, Rangeen Basu Roy Chowdhury, Elliott Forbes, Randy Widialaksono, Zhenqian Zhang, Joshua Schabel, Sungkwan Ku, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
2016 — conf
Physical design of a 3D-stacked heterogeneous multi-core processor.
3DIC
Randy Widialaksono, Rangeen Basu Roy Chowdhury, Zhenqian Zhang, Joshua Schabel, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
2015 — conf
Computing in 3D.
3DIC
Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Marcus Tshibangu, Steve Lipa
2015 — conf
Computing in 3D.
CICC
Paul D. Franzon, Eric Rotenberg, James Tuck, W. Rhett Davis, Huiyang Zhou, Joshua Schabel, Zhenqian Zhang, J. Brandon Dwiel, Elliott Forbes, Joonmoo Huh, Steve Lipa
2015 — conf
Under 100-cycle thread migration latency in a single-ISA heterogeneous multi-core processor.
Hot Chips Symposium
Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Brandon H. Dwiel, Rangeen Basu Roy Chowdhury, Vinesh Srinivasan, Steve Lipa, Eric Rotenberg, W. Rhett Davis, Paul D. Franzon
2014 — conf
3D-enabled customizable embedded computer (3DECC).
3DIC
Paul D. Franzon, Eric Rotenberg, James Tuck, Huiyang Zhou, W. Rhett Davis, Hongwen Dai, Joonmoo Huh, Sungkwan Ku, Steve Lipa, Chao Li, Jong Beom Park, Joshua Schabel
2013 C conf
Exploring early design tradeoffs in 3DIC.
ISCAS
Paul D. Franzon, Shivam Priyadarshi, Steve Lipa, W. Rhett Davis, Thorlindur Thorolfsson
2013 C conf
Rationale for a 3D heterogeneous multi-core processor.
ICCD
Eric Rotenberg, Brandon H. Dwiel, Elliott Forbes, Zhenqian Zhang, Randy Widialaksono, Rangeen Basu Roy Chowdhury, Nyunyi M. Tshibangu, Steve Lipa, W. Rhett Davis, Paul D. Franzon
2012 — conf
A 10.35 mW/GFlop stacked SAR DSP unit using fine-grain partitioned 3D integration.
CICC
Thorlindur Thorolfsson, Steve Lipa, Paul D. Franzon
2010 — conf
The NCSU Tezzaron design kit.
3DIC
Steve Lipa, Thorlindur Thorolfsson, Paul D. Franzon
2008 A* conf
Design and CAD for 3D integrated circuits.
DAC
Paul D. Franzon, W. Rhett Davis, Michael B. Steer, Steve Lipa, Eun Chu Oh, Thorlindur Thorolfsson, Samson Melamed, Sonali Luniya, Tad Doxsee, Stephen Berkeley, Ben Shani, Kurt Obermiller
2001 J jnl
Rotary traveling-wave oscillator arrays: a new clock technology.
IEEE J. Solid State Circuits
John Wood, Terence C. Edwards, Steve Lipa