Stephane Azzopardi

20 papers C 2Journal 18
YearRankTypeTitle / Venue / Authors
2019 C conf
A Study on Shunt Resistor-based Current Measurements for Fast Switching GaN Devices.
IECON
Thilini Wickramasinghe, Stephane Azzopardi, Bruno Allard, Cyril Buttay, Charles Joubert, Christian Martin, Jean-François Mogniotte, Hervé Morel, Pascal Bevilacqua, Thanh-Long Le
2019 C conf
Overview and new trends in technology bricks for reliability enhancement in future wide band gap power converters for More Electrical Aircraft (MEA) and More Electrical Propulsion (MEP) systems.
IECON
Bertrand Revol, Stephane Azzopardi, Toni Youssef, Jean Sylvio Ngoua Teu, Cyrille Gautier, Rabih Khazaka, Sara Roggia
2018 J jnl
Effect of short circuit aging on safe operating area of SiC MOSFET.
Microelectron. Reliab.
Tien Anh Nguyen, Stéphane Lefebvre, Stephane Azzopardi
2015 J jnl
Ageing mechanisms in Deep Trench Termination (DT
Microelectron. Reliab.
F. Baccar, Houssam Arbess, L. Théolier, Stephane Azzopardi, Eric Woirgard
2015 J jnl
Identification and analysis of power substrates degradations subjected to severe aging tests.
Microelectron. Reliab.
Eric Woirgard, Faical Arabi, Wissam Sabbah, Donatien Martineau, L. Théolier, Stephane Azzopardi
2015 J jnl
Mechanical stress investigation after technological process in Deep Trench Termination DT
Microelectron. Reliab.
Houssam Arbess, F. Baccar, L. Théolier, Stephane Azzopardi, Eric Woirgard
2015 J jnl
Power modules die attach: A comprehensive evolution of the nanosilver sintering physical properties versus its porosity.
Microelectron. Reliab.
Toni Youssef, W. Rmili, Eric Woirgard, Stephane Azzopardi, N. Vivet, D. M. Meekhof, Régis Meuret, G. Le Quilliec, C. Richard
2013 J jnl
Electrical characterization under mechanical stress at various temperatures of PiN power diodes in a health monitoring approach.
Microelectron. Reliab.
F. Baccar, Stephane Azzopardi, L. Théolier, K. El Boubkari, Jean-Yves Delétage, Eric Woirgard
2013 J jnl
Study of die attach technologies for high temperature power electronics: Silver sintering and gold-germanium alloy.
Microelectron. Reliab.
Wissam Sabbah, Stephane Azzopardi, Cyril Buttay, Régis Meuret, Eric Woirgard
2012 J jnl
A preliminary study on the thermal and mechanical performances of sintered nano-scale silver die-attach technology depending on the substrate metallization.
Microelectron. Reliab.
François Le Henaff, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard, Serge Bontemps, Julien Joguet
2010 J jnl
Experimental electro-mechanical static characterization of IGBT bare die under controlled temperature.
Microelectron. Reliab.
Yassine Belmehdi, Stephane Azzopardi, Jean-Yves Delétage, Eric Woirgard
2009 J jnl
An investigation into the reliability of power modules considering baseplate solders thermal fatigue in aeronautical applications.
Microelectron. Reliab.
Alexandre Micol, A. Zeanh, T. Lhommeau, Stephane Azzopardi, Eric Woirgard, Olivier Dalverny, Moussa Karama
2009 J jnl
Uni-axial mechanical stress effect on Trench Punch through IGBT under short-circuit operation.
Microelectron. Reliab.
Yassine Belmehdi, Stephane Azzopardi, A. Benmansour, Jean-Yves Delétage, Eric Woirgard
2007 J jnl
A step by step methodology to analyze the IGBT failure mechanisms under short circuit and turn-off inductive conditions using 2D physically based device simulation.
Microelectron. Reliab.
Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard
2007 J jnl
Trench IGBT failure mechanisms evolution with temperature and gate resistance under various short-circuit conditions.
Microelectron. Reliab.
Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard
2006 J jnl
Failure mechanism of trench IGBT under short-circuit after turn-off.
Microelectron. Reliab.
Adel Benmansour, Stephane Azzopardi, Jean-Christophe Martin, Eric Woirgard
2005 J jnl
Assessment of the Trench IGBT reliability: low temperature experimental characterization.
Microelectron. Reliab.
Stephane Azzopardi, A. Benmansour, M. Ishiko, Eric Woirgard
2004 J jnl
First step in the reliability assessment of ultracapacitors used as power source in hybrid electric vehicles.
Microelectron. Reliab.
Walid Lajnef, Jean-Michel Vinassa, Stephane Azzopardi, Olivier Briat, Alexandrine Guédon-Gracia, Christian Zardini
2003 J jnl
IGBT Power modules thermal characterization : what is the optimum between a low current - high voltage or a high current - low voltage test condition for the same electrical power?
Microelectron. Reliab.
Stephane Azzopardi, Eric Woirgard, Jean-Michel Vinassa, Olivier Briat, Christian Zardini
2001 J jnl
Local lifetime control IGBT structures: turn-off performances comparison for hard- and soft-switching between 1200V trench and new planar PT-IGBTs.
Microelectron. Reliab.
Stephane Azzopardi, Atsuo Kawamura, Hideo Iwamoto, Olivier Briat, Jean-Michel Vinassa, Eric Woirgard, Christian Zardini