| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2024 | J | jnl |
J. Electron. Test.
|
| 2022 | J | jnl |
J. Electron. Test.
|
| 2021 | — | conf |
ISMVL
|
| 2021 | Misc | conf |
CODES+ISSS
|
| 2021 | A | conf |
FPGA
|
| 2021 | Misc | conf |
VTS
|
| 2021 | Misc | conf |
VLSID
|
| 2021 | B | conf |
ETS
|
| 2020 | Misc | conf |
FCCM
|
| 2020 | — | conf |
NATW
|
| 2020 | J | jnl |
J. Electron. Test.
|
| 2020 | A | conf |
ITC
|
| 2020 | Misc | conf |
VTS
|
| 2019 | — | conf |
ATS
|
| 2019 | — | conf |
NATW
|
| 2019 | Misc | conf |
VTS
|
| 2019 | — | conf |
MTV
|
| 2019 | — | conf |
ISVLSI
|
| 2015 | Misc | conf |
VLSID
|
| 2014 | Misc | conf |
A Test Partitioning Technique for Scheduling Tests for Thermally Constrained 3D Integrated Circuits.
VLSID
|
| 2014 | Misc | conf |
VLSID
|
| 2014 | J | jnl |
J. Electron. Test.
|
| 2013 | — | conf |
Asian Test Symposium
|
| 2012 | — | conf |
Linear Programming Formulations for Thermal-Aware Test Scheduling of 3D-Stacked Integrated Circuits.
Asian Test Symposium
|