| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | — | conf |
ICECS
|
| 2025 | J | jnl |
IEEE Solid State Circuits Lett.
|
| 2024 | — | conf |
ISSCC
|
| 2024 | C | conf |
ISCAS
|
| 2023 | — | conf |
ISSCC
|
| 2022 | C | conf |
ISCAS
|
| 2022 | — | conf |
ITC-Asia
|
| 2021 | C | conf |
ISCAS
|
| 2020 | — | conf |
VLSI-DAT
|
| 2020 | J | jnl |
IEEE Access
|
| 2020 | — | conf |
ITC-Asia
|
| 2020 | — | conf |
VLSI-DAT
|
| 2019 | C | conf |
ISCAS
|
| 2019 | C | conf |
ISCAS
|
| 2018 | — | conf |
VLSI-DAT
|
| 2018 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2018 | J | jnl |
IEEE Des. Test
|
| 2018 | C | conf |
ISCAS
|
| 2017 | C | conf |
ISCAS
|
| 2017 | A | conf |
ISLPED
|
| 2017 | — | conf |
ITC-Asia
|
| 2017 | — | conf |
VLSI-DAT
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2016 | C | conf |
ISCAS
|
| 2016 | — | conf |
A testable and debuggable dual-core system with thermal-aware dynamic voltage and frequency scaling.
ASP-DAC
|
| 2016 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2016 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2015 | C | conf |
ISCAS
|
| 2015 | C | conf |
ISCAS
|
| 2015 | J | jnl |
Int. J. Circuit Theory Appl.
|
| 2015 | — | conf |
VLSI-DAT
|
| 2015 | — | conf |
VLSI-DAT
|
| 2014 | — | conf |
A-SSCC
|
| 2014 | C | conf |
ISCAS
|
| 2014 | J | jnl |
IEICE Trans. Electron.
|
| 2014 | J | jnl |
IEICE Trans. Electron.
|
| 2014 | C | conf |
ISCAS
|
| 2014 | — | conf |
BioCAS
|
| 2014 | — | conf |
VLSI-DAT
|
| 2013 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2013 | C | conf |
ISCAS
|
| 2013 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2013 | — | conf |
VLSI-DAT
|
| 2013 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2012 | — | conf |
APCCAS
|
| 2012 | — | conf |
VLSI-DAT
|
| 2012 | J | jnl |
IEEE J. Solid State Circuits
|
| 2012 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2012 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2012 | J | jnl |
IEICE Trans. Electron.
|
| 2012 | — | conf |
APCCAS
|
| 2012 | C | conf |
ISCAS
|
| 2012 | A | conf |
ICCAD
|
| 2012 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2012 | — | conf |
ISPD
|
| 2012 | J | jnl |
IET Circuits Devices Syst.
|
| 2011 | — | conf |
A-SSCC
|
| 2011 | J | jnl |
J. Electron. Test.
|
| 2011 | J | jnl |
IEICE Trans. Electron.
|
| 2011 | — | conf |
SoCC
|
| 2011 | A* | conf |
DAC
|
| 2011 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2010 | J | jnl |
IEEE J. Solid State Circuits
|
| 2010 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2010 | — | conf |
ISSCC
|
| 2010 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2010 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2010 | A* | conf |
DAC
|
| 2009 | J | jnl |
IEICE Trans. Electron.
|
| 2009 | — | conf |
ISSCC
|
| 2009 | — | conf |
Asian Test Symposium
|
| 2009 | — | conf |
Asian Test Symposium
|
| 2008 | J | jnl |
IEICE Trans. Electron.
|
| 2008 | J | jnl |
IEEE Trans. Circuits Syst. II Express Briefs
|
| 2008 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2008 | — | conf |
ATS
|
| 2008 | J | jnl |
IEICE Trans. Electron.
|
| 2008 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2007 | — | conf |
CICC
|
| 2007 | J | jnl |
J. Electron. Test.
|
| 2006 | C | conf |
ISCAS
|
| 2006 | — | conf |
APCCAS
|
| 2006 | C | conf |
ISCAS
|
| 2006 | — | conf |
ATS
|
| 2004 | — | conf |
Asian Test Symposium
|
| 2004 | — | conf |
Asian Test Symposium
|
| 2003 | — | conf |
Asian Test Symposium
|
| 2003 | J | jnl |
J. Inf. Sci. Eng.
|
| 2002 | J | jnl |
J. Electron. Test.
|
| 1999 | — | conf |
ETW
|
| 1997 | Misc | conf |
VTS
|