| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2023 | J | jnl |
Eng. Appl. Artif. Intell.
|
| 2020 | C | conf |
ICCE
|
| 2020 | J | jnl |
IEEE J. Sel. Top. Appl. Earth Obs. Remote. Sens.
|
| 2018 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2018 | — | conf |
ICCE-Berlin
|
| 2018 | J | jnl |
Multidimens. Syst. Signal Process.
|
| 2018 | J | jnl |
IEEE Access
|
| 2018 | — | conf |
ICCE-Berlin
|
| 2017 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2017 | C | conf |
ICCE
|
| 2017 | J | jnl |
IEEE Trans. Consumer Electron.
|
| 2017 | J | jnl |
EURASIP J. Image Video Process.
|
| 2017 | J | jnl |
Signal Process. Image Commun.
|
| 2016 | C | conf |
ICCE
|
| 2016 | — | conf |
ICCE-Berlin
|
| 2015 | — | conf |
ICCE-Berlin
|
| 2015 | J | jnl |
Sensors
|
| 2015 | J | jnl |
Sensors
|