| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2026 | J | jnl |
Pattern Recognit.
|
| 2026 | J | jnl |
Pattern Recognit.
|
| 2026 | J | jnl |
Vis. Comput.
|
| 2026 | J | jnl |
Pattern Recognit.
|
| 2026 | J | jnl |
Pattern Recognit.
|
| 2026 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2026 | J | jnl |
IEEE Trans. Pattern Anal. Mach. Intell.
|
| 2025 | J | jnl |
Knowl. Based Syst.
|
| 2025 | Misc | conf |
MVA
|
| 2025 | — | conf |
COPA
|
| 2025 | A* | conf |
CVPR
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
Neurocomputing
|
| 2025 | J | jnl |
Comput. Ind. Eng.
|
| 2025 | J | jnl |
IEEE Trans. Image Process.
|
| 2025 | J | jnl |
J. Vis. Commun. Image Represent.
|
| 2025 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2025 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2025 | J | jnl |
IEEE Trans. Multim.
|
| 2024 | J | jnl |
Pattern Recognit.
|
| 2024 | A | conf |
ICME
|
| 2024 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2024 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2024 | — | conf |
ACCV (1)
|
| 2024 | J | jnl |
Pattern Recognit.
|
| 2024 | J | jnl |
Pattern Recognit.
|
| 2024 | J | jnl |
Pattern Recognit.
|
| 2024 | J | jnl |
CoRR
|
| 2024 | — | conf |
ECCV (42)
|
| 2024 | J | jnl |
CoRR
|
| 2024 | B | conf |
IJCNN
|
| 2024 | J | jnl |
Toward Better Generalization: Shape Feature-Enhanced Fastener Defect Detection With Diffusion Model.
IEEE Trans. Instrum. Meas.
|
| 2024 | Misc | conf |
ICASSP
|
| 2023 | J | jnl |
Appl. Intell.
|
| 2023 | J | jnl |
Expert Syst. Appl.
|
| 2023 | J | jnl |
Multim. Tools Appl.
|
| 2023 | Misc | conf |
ICASSP
|
| 2023 | B | conf |
ICIP
|
| 2023 | J | jnl |
Knowl. Based Syst.
|
| 2023 | Misc | conf |
MVA
|
| 2023 | Misc | conf |
MVA
|
| 2023 | Misc | conf |
ICASSP
|
| 2023 | A* | conf |
AAAI
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2023 | B | conf |
ICIP
|
| 2023 | A* | conf |
ICCV
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2023 | J | jnl |
J. Vis. Commun. Image Represent.
|
| 2022 | J | jnl |
IEEE Trans Autom. Sci. Eng.
|
| 2022 | J | jnl |
IEEE Trans. Intell. Transp. Syst.
|
| 2022 | J | jnl |
IEEE Trans. Circuits Syst. Video Technol.
|
| 2022 | — | conf |
ICANN (4)
|
| 2022 | — | conf |
PRICAI (3)
|
| 2022 | B | conf |
ICIP
|
| 2022 | — | conf |
CISP-BMEI
|
| 2022 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | — | conf |
CSAE
|
| 2021 | J | jnl |
Connect. Sci.
|
| 2021 | C | conf |
CSCWD
|
| 2021 | — | conf |
ICANN (3)
|
| 2021 | J | jnl |
Multim. Tools Appl.
|
| 2021 | — | conf |
WCSP
|
| 2021 | J | jnl |
Multim. Tools Appl.
|
| 2021 | J | jnl |
CoRR
|
| 2020 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2020 | C | conf |
HSI
|
| 2020 | J | jnl |
Serv. Oriented Comput. Appl.
|
| 2020 | B | conf |
RTCSA
|
| 2020 | C | conf |
HSI
|
| 2020 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2020 | J | jnl |
IEICE Trans. Inf. Syst.
|
| 2019 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2019 | Misc | conf |
MVA
|
| 2019 | C | conf |
ISCAS
|
| 2019 | J | jnl |
Multim. Tools Appl.
|
| 2019 | — | conf |
AIVR
|
| 2019 | — | conf |
APSIPA
|
| 2019 | Misc | conf |
MVA
|
| 2018 | J | jnl |
Sensors
|
| 2018 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2018 | — | conf |
ISPACS
|
| 2018 | B | conf |
ICPR
|
| 2017 | J | jnl |
IEICE Trans. Fundam. Electron. Commun. Comput. Sci.
|
| 2017 | J | jnl |
Multim. Tools Appl.
|
| 2017 | — | conf |
PCM (2)
|
| 2017 | — | conf |
ISPACS
|
| 2016 | — | conf |
BIOIMAGING
|
| 2016 | J | jnl |
Blind image quality assessment with the histogram sequences of high-order local derivative patterns.
Digit. Signal Process.
|
| 2016 | J | jnl |
IET Image Process.
|
| 2015 | J | jnl |
IEEE Signal Process. Lett.
|