| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
IEEE Trans. Ind. Electron.
|
| 2025 | J | jnl |
IEEE Trans. Veh. Technol.
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
CoRR
|
| 2024 | J | jnl |
IEEE Internet Things J.
|
| 2024 | J | jnl |
IEEE Trans. Intell. Veh.
|
| 2023 | J | jnl |
CoRR
|
| 2023 | J | jnl |
Adv. Eng. Informatics
|
| 2022 | — | conf |
ICPHM
|
| 2022 | J | jnl |
CoRR
|
| 2021 | J | jnl |
IEEE Trans. Ind. Informatics
|
| 2021 | — | conf |
ICPHM
|
| 2021 | J | jnl |
IEEE Access
|
| 2021 | — | conf |
ICPHM
|
| 2021 | J | jnl |
Reliab. Eng. Syst. Saf.
|
| 2021 | — | conf |
ICPHM
|
| 2021 | J | jnl |
IEEE Trans. Instrum. Meas.
|
| 2021 | J | jnl |
IEEE Internet Things J.
|
| 2020 | — | conf |
ICPHM
|
| 2020 | J | jnl |
IEEE Access
|
| 2019 | — | conf |
ICPHM
|
| 2019 | — | conf |
ICPHM
|
| 2019 | — | conf |
ICPHM
|
| 2019 | J | jnl |
Health Assessment Method for Electronic Components Subject to Condition Monitoring and Hard Failure.
IEEE Trans. Instrum. Meas.
|
| 2018 | — | conf |
ICPHM
|
| 2018 | J | jnl |
Microelectron. Reliab.
|
| 2018 | J | jnl |
IEEE Trans. Reliab.
|
| 2016 | — | conf |
ICPHM
|
| 2016 | — | conf |
ICSPS
|