Shreepad Panth

24 papers A* 3A 2C 1Misc 2Journal 9Unranked 6
YearRankTypeTitle / Venue / Authors
2017 J jnl
Shrunk-2-D: A Physical Design Methodology to Build Commercial-Quality Monolithic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2017 J jnl
Tier Degradation of Monolithic 3-D ICs: A Power Performance Study at Different Technology Nodes.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Shreepad Panth, Sandeep Kumar Samal, Kambiz Samadi, Yang Du, Sung Kyu Lim
2016 J jnl
Adaptive Regression-Based Thermal Modeling and Optimization for Monolithic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2016 — conf
Monolithic 3D IC design: Power, performance, and area impact at 7nm.
ISQED
Kartik Acharya, Kyungwook Chang, Bon Woong Ku, Shreepad Panth, Saurabh Sinha, Brian Cline, Greg Yeric, Sung Kyu Lim
2016 J jnl
More Power Reduction With 3-Tier Logic-on-Logic 3-D ICs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim
2015 J jnl
Design and Analysis of 3D-MAPS (3D Massively Parallel Processor with Stacked Memory).
IEEE Trans. Computers
Daehyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
2015 — —
Physical design methodologies for monolithic 3D ICs.
Shreepad Panth
2015 J jnl
Placement-Driven Partitioning for Congestion Mitigation in Monolithic 3D IC Designs.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2015 J jnl
Scan Test of Die Logic in 3-D ICs Using TSV Probing.
IEEE Trans. Very Large Scale Integr. Syst.
Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim
2015 A conf
Three-Tier 3D ICs for More Power Reduction: Strategies in CAD, Design, and Bonding Selection.
ICCAD
Taigon Song, Shreepad Panth, Yoo-Jin Chae, Sung Kyu Lim
2015 A* conf
Tier-partitioning for power delivery vs cooling tradeoff in 3D VLSI for mobile applications.
DAC
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2014 J jnl
Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs.
J. Inform. and Commun. Convergence Engineering
Shreepad Panth, Sandeep Kumar Samal, Yun Seop Yu, Sung Kyu Lim
2014 A* conf
Fast and Accurate Thermal Modeling and Optimization for Monolithic 3D ICs.
DAC
Sandeep Kumar Samal, Shreepad Panth, Kambiz Samadi, Mehdi Saedi, Yang Du, Sung Kyu Lim
2014 — conf
Placement-driven partitioning for congestion mitigation in monolithic 3D IC designs.
ISPD
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2014 A* conf
Power-Performance Study of Block-Level Monolithic 3D-ICs Considering Inter-Tier Performance Variations.
DAC
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2013 — conf
High-density integration of functional modules using monolithic 3D-IC technology.
ASP-DAC
Shreepad Panth, Kambiz Samadi, Yang Du, Sung Kyu Lim
2013 J jnl
IsoNet: Hardware-Based Job Queue Management for Many-Core Architectures.
IEEE Trans. Very Large Scale Integr. Syst.
Junghee Lee, Chrysostomos Nicopoulos, Hyung Gyu Lee, Shreepad Panth, Sung Kyu Lim, Jongman Kim
2013 — conf
Test-TSV estimation during 3D-IC partitioning.
3DIC
Shreepad Panth, Kambiz Samadi, Sung Kyu Lim
2012 — conf
3D-MAPS: 3D Massively parallel processor with stacked memory.
ISSCC
Dae Hyun Kim, Krit Athikulwongse, Michael B. Healy, Mohammad M. Hossain, Moongon Jung, Ilya Khorosh, Gokul Kumar, Young-Joon Lee, Dean L. Lewis, Tzu-Wei Lin, Chang Liu, Shreepad Panth, Mohit Pathak, Minzhen Ren, Guanhao Shen, Taigon Song, Dong Hyuk Woo, Xin Zhao, Joungho Kim, Ho Choi, Gabriel H. Loh, Hsien-Hsin S. Lee, Sung Kyu Lim
2012 A conf
Scan test of die logic in 3D ICs using TSV probing.
ITC
Brandon Noia, Shreepad Panth, Krishnendu Chakrabarty, Sung Kyu Lim
2012 — conf
TSV Stress-Aware ATPG for 3D Stacked ICs.
Asian Test Symposium
Sergej Deutsch, Krishnendu Chakrabarty, Shreepad Panth, Sung Kyu Lim
2012 Misc conf
Transition delay fault testing of 3D ICs with IR-drop study.
VTS
Shreepad Panth, Sung Kyu Lim
2011 C conf
Designing 3D test wrappers for pre-bond and post-bond test of 3D embedded cores.
ICCD
Dean L. Lewis, Shreepad Panth, Xin Zhao, Sung Kyu Lim, Hsien-Hsin S. Lee
2011 Misc conf
Scan chain and power delivery network synthesis for pre-bond test of 3D ICs.
VTS
Shreepad Panth, Sung Kyu Lim