Shengcheng Wang

15 papers A 5Journal 4Unranked 4
YearRankTypeTitle / Venue / Authors
2022 — conf
COMB-MCM: Computing-on-Memory-Boundary NN Processor with Bipolar Bitwise Sparsity Optimization for Scalable Multi-Chiplet-Module Edge Machine Learning.
ISSCC
Haozhe Zhu, Bo Jiao, Jinshan Zhang, Xinru Jia, Yunzhengmao Wang, Tianchan Guan, Shengcheng Wang, Dimin Niu, Hongzhong Zheng, Chixiao Chen, Mingyu Wang, Lihua Zhang, Xiaoyang Zeng, Qi Liu, Yuan Xie, Ming Liu
2019 J jnl
Defect Clustering-Aware Spare-TSV Allocation in 3-D ICs for Yield Enhancement.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Shengcheng Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori
2019 — book
Long-Term Reliability of Nanometer VLSI Systems, Modeling, Analysis and Optimization.
Sheldon X.-D. Tan, Mehdi Baradaran Tahoori, Taeyoung Kim, Shengcheng Wang, Zeyu Sun, Saman Kiamehr
2018 J jnl
Multicast Testing of Interposer-Based 2.5D ICs: Test-Architecture Design and Test Scheduling.
ACM Trans. Design Autom. Electr. Syst.
Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori
2018 J jnl
Recovery-Aware Proactive TSV Repair for Electromigration Lifetime Enhancement in 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst.
Shengcheng Wang, Taeyoung Kim, Zeyu Sun, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
2018 — —
Reliable Design of Three-Dimensional Integrated Circuits
Shengcheng Wang
2017 J jnl
Electromigration-Aware Local-Via Allocation in Power/Ground TSVs of 3-D ICs.
IEEE Trans. Very Large Scale Integr. Syst.
Shengcheng Wang, Mehdi Baradaran Tahoori
2017 A conf
Leveraging recovery effect to reduce electromigration degradation in power/ground TSV.
ICCAD
Shengcheng Wang, Zeyu Sun, Yuan Cheng, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
2017 A conf
Recovery-aware proactive TSV repair for electromigration in 3D ICs.
DATE
Shengcheng Wang, Hengyang Zhao, Sheldon X.-D. Tan, Mehdi Baradaran Tahoori
2016 — conf
Multicast Test Architecture and Test Scheduling for Interposer-Based 2.5D ICs.
ATS
Shengcheng Wang, Ran Wang, Krishnendu Chakrabarty, Mehdi Baradaran Tahoori
2016 A conf
Thermal-aware TSV repair for electromigration in 3D ICs.
DATE
Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty
2015 — conf
Deadspace-aware Power/Ground TSV planning in 3D floorplanning.
ICICDT
Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori
2015 A conf
Defect Clustering-Aware Spare-TSV Allocation for 3D ICs.
ICCAD
Shengcheng Wang, Mehdi Baradaran Tahoori, Krishnendu Chakrabarty
2015 — conf
Stress-aware P/G TSV planning in 3D-ICs.
ASP-DAC
Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori
2014 A conf
P/G TSV planning for IR-drop reduction in 3D-ICs.
DATE
Shengcheng Wang, Farshad Firouzi, Fabian Oboril, Mehdi Baradaran Tahoori