| Year | Rank | Type | Title / Venue / Authors |
|---|---|---|---|
| 2026 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2026 | — | conf |
ISPD
|
| 2025 | A | conf |
ICCAD
|
| 2025 | A | conf |
ICCAD
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | J | jnl |
CoRR
|
| 2025 | J | jnl |
ACM Trans. Design Autom. Electr. Syst.
|
| 2025 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2025 | A* | conf |
DAC
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | — | conf |
ASP-DAC
|
| 2025 | A | conf |
ICCAD
|
| 2025 | A* | conf |
DAC
|
| 2025 | — | conf |
ASP-DAC
|
| 2024 | A* | conf |
DAC
|
| 2024 | J | jnl |
CoRR
|
| 2024 | A | conf |
ICCAD
|
| 2024 | — | conf |
ISPD
|
| 2024 | A | conf |
ICCAD
|
| 2023 | — | conf |
ISPD
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | — | conf |
ASP-DAC
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2023 | A* | conf |
DAC
|
| 2023 | — | conf |
ASP-DAC
|
| 2023 | A | conf |
DATE
|
| 2023 | — | conf |
ISPD
|
| 2023 | A | conf |
ICCAD
|
| 2022 | A | conf |
ICCAD
|
| 2022 | J | jnl |
Demand-Driven Multi-Target Sample Preparation on Resource-Constrained Digital Microfluidic Biochips.
ACM Trans. Design Autom. Electr. Syst.
|
| 2022 | J | jnl |
CoRR
|
| 2022 | — | conf |
MLCAD
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | — | conf |
ASP-DAC
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2021 | J | jnl |
Microelectron. J.
|
| 2021 | — | conf |
ISQED
|
| 2020 | A | conf |
ICCAD
|
| 2020 | — | conf |
ASP-DAC
|
| 2020 | J | jnl |
CoRR
|
| 2020 | J | jnl |
CoRR
|
| 2020 | A | conf |
ICCAD
|
| 2020 | — | conf |
ISPD
|
| 2020 | A | conf |
ICCAD
|
| 2020 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2020 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2020 | — | conf |
VLSI-DAT
|
| 2020 | — | conf |
ISPD
|
| 2019 | — | conf |
ISPACS
|
| 2019 | — | conf |
ASP-DAC
|
| 2019 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2019 | A* | conf |
DAC
|
| 2019 | J | jnl |
IEEE Trans. Emerg. Top. Comput.
|
| 2019 | A | conf |
DATE
|
| 2018 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2018 | — | conf |
ASP-DAC
|
| 2018 | — | conf |
ISVLSI
|
| 2018 | A* | conf |
DAC
|
| 2018 | A* | conf |
DAC
|
| 2018 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2018 | A | conf |
ICCAD
|
| 2018 | — | conf |
VLSI-DAT
|
| 2017 | J | jnl |
IEEE Trans. Very Large Scale Integr. Syst.
|
| 2017 | J | jnl |
IEEE Trans. Circuits Syst. I Regul. Pap.
|
| 2017 | — | conf |
ASP-DAC
|
| 2017 | A* | conf |
DAC
|
| 2017 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2017 | A | conf |
ICCAD
|
| 2016 | — | conf |
APCCAS
|
| 2016 | J | jnl |
Overlay-Aware Detailed Routing for Self-Aligned Double Patterning Lithography Using the Cut Process.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | A* | conf |
DAC
|
| 2015 | — | conf |
ASP-DAC
|
| 2015 | A | conf |
ICCAD
|
| 2015 | A | conf |
ICCAD
|
| 2015 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2014 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2014 | A* | conf |
Overlay-Aware Detailed Routing for Self-Aligned Double Patterning Lithography Using the Cut Process.
DAC
|
| 2013 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2013 | — | conf |
ISPD
|
| 2013 | A* | conf |
DAC
|
| 2012 | A* | conf |
DAC
|
| 2012 | — | conf |
ISPD
|
| 2012 | J | jnl |
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
|
| 2012 | A* | conf |
DAC
|
| 2010 | A | conf |
ICCAD
|