Seungbae Park

15 papers Journal 14Unranked 1
YearRankTypeTitle / Venue / Authors
2025 J jnl
ReflowNet: ConvLSTM-based direct reflow oven recipe optimization framework.
J. Intell. Manuf.
Jun Kataoka, Abdelrahman Farrag, Yangyang Lai, Seungbae Park, Yu Jin, Daehan Won
2020 J jnl
Optimization of Passive Chip Components Placement with Self-Alignment Effect for Advanced Surface Mounting Technology.
CoRR
Irandokht Parviziomran, Shun Cao, Haeyong Yang, Seungbae Park, Daehan Won
2020 J jnl
Prediction of Component Shifts in Pick and Place Process of Surface Mount Technology Using Support Vector Regression.
CoRR
Shun Cao, Irandokht Parviziomran, Haeyong Yang, Seungbae Park, Daehan Won
2018 J jnl
A comprehensive solution for electronic packages' reliability assessment with digital image correlation (DIC) method.
Microelectron. Reliab.
Yuling Niu, Jing Wang, Shuai Shao, Huayan Wang, Hohyung Lee, Seungbae Park
2017 J jnl
A Study on the Thermomechanical Reliability Risks of Through-Silicon-Vias in Sensor Applications.
Sensors
Shuai Shao, Dapeng Liu, Yuling Niu, Kathy O'Donnell, Dipak Sengupta, Seungbae Park
2017 J jnl
Advancement in simulating moisture diffusion in electronic packages under dynamic thermal loading conditions.
Microelectron. Reliab.
Jing Wang, Ruiyang Liu, Dapeng Liu, Seungbae Park
2016 J jnl
Prediction of deformation during manufacturing processes of silicon interposer package with TSVs.
Microelectron. Reliab.
Yeonsung Kim, Ah-Young Park, Chin-Li Kao, Michael Su, Bryan Black, Seungbae Park
2016 J jnl
Risk assessment of the crack propagation and delamination of the Cu-to-Cu direct bonded (CuDB) interface.
Microelectron. Reliab.
Ah-Young Park, Satish C. Chaparala, Seungbae Park
2011 J jnl
Characterization of elasto-plastic behavior of actual SAC solder joints for drop test modeling.
Microelectron. Reliab.
Tung T. Nguyen, Seungbae Park
2011 J jnl
High-cycle fatigue life prediction for Pb-free BGA under random vibration loading.
Microelectron. Reliab.
Da Yu, Abdullah Al-Yafawi, Tung T. Nguyen, Seungbae Park, Soonwan Chung
2010 J jnl
Dynamic responses of PCB under product-level free drop impact.
Microelectron. Reliab.
Da Yu, Jae B. Kwak, Seungbae Park, John Lee
2010 J jnl
Effect of glue on reliability of flip chip BGA packages under thermal cycling.
Microelectron. Reliab.
Tung T. Nguyen, Donggun Lee, Jae B. Kwak, Seungbae Park
2008 J jnl
Failure analysis of contact probe pins for SnPb and Sn applications.
Microelectron. Reliab.
Changsoo Jang, Seungbae Park, Bill Infantolino, Lawrence Lehman, Ryan Morgan, Dipak Sengupta
2006 J jnl
Improving Accessibility and Security for Mobile Phone Shopping.
J. Comput. Inf. Syst.
Sangjun Lee, Seungbae Park
2005 — conf
Mobile Password System for Enhancing Usability-Guaranteed Security in Mobile Phone Banking.
Human.Society@Internet
Sang Jun Lee, Seungbae Park