Seung Ho Shin

18 papers Journal 10Unranked 8
YearRankTypeTitle / Venue / Authors
2026 J jnl
A Low Area Built-In Self-Repair Using Hybrid Fault Address Memory for HBM.
IEEE Trans. Very Large Scale Integr. Syst.
Byungsoo Kim, Seung Ho Shin, Youngki Moon, Eugene Jeong, Sungho Kang
2026 J jnl
STAR-PIM: Self-Test and Repair Structure for Processing-in-Memory With Adder Tree-Based MAC.
IEEE Trans. Circuits Syst. I Regul. Pap.
Seung Ho Shin, Younwoo Yoo, Youngki Moon, Nuri Son, Dahoon Kim, Sungho Kang
2025 J jnl
A Built-In Self-Repair With Maximum Fault Collection and Fast Analysis Method for HBM.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Joonsik Yoon, Hayoung Lee, Youngki Moon, Seung Ho Shin, Sungho Kang
2025 J jnl
A Novel CNN-Based Redundancy Analysis Using Parallel Solution Decision.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Seung Ho Shin, Minho Cheong, Hayoung Lee, Byungsoo Kim, Sungho Kang
2025 J jnl
A Novel Prediction-Based Two-Tiered ECC for Mitigating SWD Errors in HBM.
IEEE Trans. Very Large Scale Integr. Syst.
Youngki Moon, Seung Ho Shin, Seokjun Jang, Duyeon Won, Sungho Kang
2025 J jnl
Effective Parallel Redundancy Analysis Using GPU for Memory Repair.
IEEE Trans. Very Large Scale Integr. Syst.
Seung Ho Shin, Hayoung Lee, Sungho Kang
2025 J jnl
RAPID: Redundancy Analysis With Parallelized and Intelligent Distribution.
IEEE Access
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang
2024 — conf
Effective Data-Width Aware ECC Scheme for HBM.
ISOCC
Seung Ho Shin, Youngki Moon, Byungsoo Kim, Sungho Kang
2024 J jnl
GRAP: Efficient GPU-Based Redundancy Analysis Using Parallel Evaluation for Cross Faults.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Seung Ho Shin, Hayoung Lee, Sungho Kang
2023 — conf
GPU-Based Redundancy Analysis using Partitioning Method for Memory Repair.
ISOCC
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang
2023 — conf
Redundancy Analysis Simplification Scheme for High-Speed Memory Repair.
ISOCC
Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
2023 J jnl
TRUST: Through-Silicon via Repair Using Switch Matrix Topology.
IEEE Trans. Comput. Aided Des. Integr. Circuits Syst.
Hayoung Lee, Seung Ho Shin, Younwoo Yoo, Sungho Kang
2022 — conf
An Improved Early Termination Methodology Using Convolutional Neural Network.
ISOCC
Seung Ho Shin, Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Sungho Kang
2022 J jnl
ECMO: ECC Architecture Reusing Content-Addressable Memories for Obtaining High Reliability in DRAM.
IEEE Trans. Very Large Scale Integr. Syst.
Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
2022 — conf
FAME: Fault Address Memory Structure for Repair Time Reduction.
ISOCC
Hayoung Lee, Sooryeong Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
2022 — conf
PROG: Per-Row Output Generator for BOST.
ISOCC
Sooryeong Lee, Hayoung Lee, Younwoo Yoo, Seung Ho Shin, Sungho Kang
2021 — conf
An Effective Spare Allocation Methodology for 3D Memory Repair with BIRA.
ISOCC
Seung Ho Shin, Hayoung Lee, Younwoo Yoo, Sungho Kang
2021 — conf
Post-bond Repair of Line Faults with Double-bit ECC for 3D Memory.
ISOCC
Younwoo Yoo, Hayoung Lee, Seung Ho Shin, Sungho Kang